Inventor
Seshasayee Varadarajan
Inventor
Lake Oswego, OR, US
Overview
Patents· 40 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
C25DProcesses for the electrolytic or electrophoretic production of coatings17%
C23CCoating metallic material15%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%
H01LSemiconductor devices8%
H10DInorganic electric semiconductor devices6%
C25FProcesses for the electrolytic removal of materials from objects4%
H01JElectric discharge tubes or discharge lamps4%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
H05KPrinted circuits2%
PatentTitleYear
11,088,019Method to create air gaps202111,075,127Suppressing interfacial reactions by varying the wafer temperature throughout deposition202110,472,730Electrolyte concentration control system for high rate electroplating201910,378,107Low volume showerhead with faceplate holes for improved flow uniformity201910,347,547Suppressing interfacial reactions by varying the wafer temperature throughout deposition201910,020,188Method for depositing ALD films using halide-based precursors20189,824,884'Method for depositing metals free ald silicon nitride films using halide-based precursors'20179,624,578'Method for RF compensation in plasma assisted atomic layer deposition'20179,601,693'Method for encapsulating a chalcogenide material'20179,353,444'Two-step deposition with improved selectivity'20169,309,604'Method and apparatus for electroplating'20169,109,295'Electrolyte concentration control system for high rate electroplating'20159,045,841'Control of electrolyte composition in a copper electroplating apparatus'20159,029,258'Through silicon via metallization'20158,475,636'Method and apparatus for electroplating'20138,475,644'Method and apparatus for electroplating'20138,398,831'Rapidly cleanable electroplating cup seal'20138,377,268'Electroplating cup assembly'20138,362,571'High compressive stress carbon liners for MOS devices'20138,308,931'Method and apparatus for electroplating'20128,217,513'Remote plasma processing of interface surfaces'20128,128,791'Control of electrolyte composition in a copper electroplating apparatus'20128,084,339'Remote plasma processing of interface surfaces'20117,998,881'Method for making high stress boron-doped carbon films'20117,985,325'Closed contact electroplating cup assembly'20117,935,231'Rapidly cleanable electroplating cup assembly'20117,906,817'High compressive stress carbon liners for MOS devices'20117,858,510'Interfacial layers for electromigration resistance improvement in damascene interconnects'20107,854,828'Method and apparatus for electroplating including remotely positioned second cathode'20107,799,671'Interfacial layers for electromigration resistance improvement in damascene interconnects'20107,799,684'Two step process for uniform across wafer deposition and void free filling on ruthenium coated wafers'20107,780,867'Edge bevel removal of copper from silicon wafers'20107,686,927'Methods and apparatus for controlled-angle wafer positioning'20107,648,899'Interfacial layers for electromigration resistance improvement in damascene interconnects'20107,456,102'Electroless copper fill process'20087,097,410'Methods and apparatus for controlled-angle wafer positioning'20066,964,792'Methods and apparatus for controlling electrolyte flow for uniform plating'20056,821,407'Anode and anode chamber for copper electroplating'20046,586,342'Edge bevel removal of copper from silicon wafers'20036,551,487'Methods and apparatus for controlled-angle wafer immersion'2003Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2003–2019Patents assigned to NOVELLUS SYSTEMS INC (30)· patent assignee history
2003–2010Based in Wilsonville, OR, US· patent location history
2008–2021Based in Lake Oswego, OR, US· patent location history
2011–2015Patents assigned to VARADARAJAN SESHASAYEE (11)· patent assignee history
2011–2013Based in Lake Owsego, OR, US· patent location history
2012–2015Patents assigned to HE ZHIAN (6)· patent assignee history
2012–2015Patents assigned to BUCKALEW BRYAN (5)· patent assignee history
2015–2021Patents assigned to LAM RES CORP (10)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| NOVELLUS SYSTEMS INC | 30 | 2003–2019 |
| VARADARAJAN SESHASAYEEself | 11 | 2011–2015 |
| LAM RES CORP | 10 | 2015–2021 |
| HE ZHIAN | 6 | 2012–2015 |
| BUCKALEW BRYAN | 5 | 2012–2015 |
Locations
| Location | Patents | Span |
|---|---|---|
| Lake Oswego, OR, US | 31 | 2008–2021 |
| Wilsonville, OR, US | 7 | 2003–2010 |
| Lake Owsego, OR, US | 2 | 2011–2013 |