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Inventor

Hiroyuki Toyoda

Inventor
Hitachinaka, JP

Overview

19→
Patents
1991–2019
Patent span
Physics
Primary field (CPC G)

Patents· 19 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

G11Bprimary
G11BInformation storage based on relative movement between record carrier and transducer15%
H05KPrinted circuits15%
B62DMotor vehicles9%
G06FElectric digital data processing9%
C23CCoating metallic material6%
F16DCouplings for transmitting rotation6%
F28DHeat-exchange apparatus, not provided for in another subclass, in which the heat-exchange media do not come into direct contact6%
G01NInvestigating or analysing materials by determining their chemical or physical properties6%
F16HGearing3%
F28FDetails of heat-exchange and heat-transfer apparatus, of general application3%
PatentTitleYear
D0860705Beverage dispenser201910,046,791Moisture sensor and steering system20189,920,794'Torque limiter, variable transmission ratio device, and tolerance ring'20189,109,632'Torque limiter, variable transmission ratio device, and tolerance ring'20158,813,569'Ultrasonic sensor'20148,345,425'Cooling system and electronic apparatus applying the same therein'20138,284,640'Optical pickup'20128,164,902'Electronic apparatus'20128,130,497'Blade server'20127,936,560'Cooling device and electronic equipment including cooling device'20117,890,967'Optical pickup device with heat radiating structure'20117,839,640'Electronic device and a thermal connector used therein'20107,826,217'Cooling device and electronic apparatus using the same'20107,543,310'Optical disk apparatus with openings for discharging air from therein'20097,420,891'Optical pickup device having heat radiation means and optical disk apparatus using the same'20087,383,557'Recording disk apparatus having regions of constrained thermal conduction'20086,674,299'Semiconductor tester, semiconductor integrated circuit and semiconductor testing method'20045,270,659'Apparatus for measuring deposition speed of electroless plating'19935,076,840'Electroless copper plating solution'1991

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2008–2012Patents assigned to HITACHI MEDIA ELECTRON KK (3)· patent assignee history
2008Based in Chiyoda-ku, JP· patent location history
2009–2012Based in Hitachinaka, JP· patent location history
2010–2013Patents assigned to HITACHI LTD (6)· patent assignee history
2012–2015Patents assigned to TOYODA HIROYUKI (6)· patent assignee history
2012–2013Patents assigned to IDEI AKIO (3)· patent assignee history
2012–2013Based in Mito, JP· patent location history
2015–2018Patents assigned to JTEKT CORP (3)· patent assignee history
2015–2018Based in Mie, JP· patent location history
2019Based in Kanagawa, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HITACHI LTD62010–2013
TOYODA HIROYUKIself62012–2015
HITACHI MEDIA ELECTRON KK32008–2012
IDEI AKIO32012–2013
JTEKT CORP32015–2018
Locations
LocationPatentsSpan
Hitachinaka, JP72009–2012
Mie, JP22015–2018
Mito, JP22012–2013
Chiyoda-ku, JP22008
Kanagawa, JP12019