Inventor

Shin Kawakami

Inventor

Saitama, JP

Overview

33→

Patents

1989–1995

Patent span

Electricity

Primary field (CPC H)

Patents· 33 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary

H05KPrinted circuits60%

Y10TTechnical subjects covered by former us classification18%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests7%

C23FNon-mechanical removal of metallic material from surface4%

F42BExplosive charges, e.g. for blasting, fireworks, ammunition2%

G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices2%

H01CResistors2%

H01QAntennas, i.e. radio aerials2%

H01RElectrically-conductive connections2%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h102%

PatentTitleYear

5,416,667'Printed wiring board having an electromagnetic wave shielding layer'1995 5,404,637'Method of manufacturing multilayer printed wiring board'1995 5,308,644'Method for manufacturing a printed wiring board having a shield layer'1994 5,294,755'Printed wiring board having shielding layer'1994 5,293,004'Printed circuit board having an electromagnetic shielding layer'1994 5,268,194'Method of packing filler into through-holes in a printed circuit board'1993 5,268,535'Printed wiring board'1993 5,266,748'Printed wiring board having through-holes covered with ink layer and method of manufacture thereof'1993 5,262,596'Printed wiring board shielded from electromagnetic wave'1993 5,256,442'Screen printing method for forming a multiplicity of printed wiring boards'1993 5,250,757'Printed wiring board having a connecting terminal'1993 5,240,737'Method of manufacturing printed circuit boards'1993 5,236,736'Method for manufacturing an electromagnetic wave shield printed wiring board'1993 5,234,745'Method of forming an insulating layer on a printed circuit board'1993 5,219,607'Method of manufacturing printed circuit board'1993 5,220,135'Printed wiring board having shielding layer'1993 5,210,940'Method of producing a printed circuit board'1993 5,195,238'Method of manufacturing a printed circuit board'1993 5,191,709'Method of forming through-holes in printed wiring board'1993 5,180,465'Etching method of forming microcircuit patterns on a printed circuit board'1993 5,169,477'Etching apparatus for forming microcircuit patterns on a printed circuit board'1992 5,145,691'Apparatus for packing filler into through-holes or the like in a printed circuit board'1992 5,133,120'Method of filling conductive material into through holes of printed wiring board'1992 5,100,695'Method of manufacturing a printed circuit board'1992 5,030,800'Printed wiring board with an electronic wave shielding layer'1991 5,028,743'Printed circuit board with filled throughholes'1991 5,025,116'Printed wiring board having electromagnetic wave shielding layer'1991 4,991,060'Printed circuit board having conductors interconnected by foamed electroconductive paste'1991 4,929,491'Printed wiring board'1990 4,900,602'Printed wiring board'1990 4,885,431'Printed circuit board'1989 4,859,805'Printed wiring board'1989 4,806,706'Printed wiring board'1989

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1989–1995Patents assigned to NIPPON CMK KK (33)· patent assignee history

1989–1994Based in Saitama, JP· patent location history

1991–1995Based in Iruma, JP· patent location history

1992–1993Based in Fujikubo, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
NIPPON CMK KK	33	1989–1995

Locations

Location	Patents	Span
Saitama, JP	23	1989–1994
Iruma, JP	8	1991–1995
Fujikubo, JP	2	1992–1993