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Inventor

Shih-Min Tseng

Inventor
Taichung, TW

Overview

2→
Patents
2017–2020
Patent span
Chemistry
Primary field (CPC C)

Patents· 2 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C23Cprimary
C23CCoating metallic material50%
G06FElectric digital data processing50%
PatentTitleYear
10,755,022Electronic apparatus and layout method for integrated circuit20209,605,345'Vertical furnace for improving wafer uniformity'2017

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2017Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (1)· patent assignee history
2017Based in Zhubei City, TW· patent location history
2020Patents assigned to WINBOND ELECTRONICS CORP (1)· patent assignee history
2020Based in Taichung, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD12017
WINBOND ELECTRONICS CORP12020
Locations
LocationPatentsSpan
Taichung, TW12020
Zhubei City, TW12017