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Inventor

GUOTAO WANG

Inventor
US

Overview

6→
Patents
2022–2026
Patent span
Electricity
Primary field (CPC H)

Patents· 6 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices31%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
B29CShaping or joining of plastics6%
B29LIndexing scheme associated with subclass b29c, relating to particular articles6%
H01FMagnets6%
H02MApparatus for conversion between ac and ac, between ac and dc, or between dc and dc, and for use with mains or similar power supply systems6%
H05KPrinted circuits6%
H10DInorganic electric semiconductor devices6%
PatentTitleYear
12,558,834PEX expander202612,476,235Multi-chip packaging202512,199,085Multi-chip packaging202511,817,444Multi-chip packaging202311,373,966Embedded thin-film magnetic inductor design for integrated voltage regulator (IVR) applications202211,348,911Multi-chip packaging2022

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2022–2025Patents assigned to INTEL CORP (4)· patent assignee history
2022Patents assigned to HUAWEI TECH CO LTD (1)· patent assignee history
2022–2025Based in US· patent location history
2026Patents assigned to BLACK & DECKER INC (1)· patent assignee history
2026Based in CN· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
INTEL CORP42022–2025
BLACK & DECKER INC12026
HUAWEI TECH CO LTD12022
Locations
LocationPatentsSpan
US52022–2025
CN12026