Inventor
Seiji Muranaka
Inventor
Tokyo, JP
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1028%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
H01LSemiconductor devices15%
B08BCleaning in general9%
C23CCoating metallic material9%
H10DInorganic electric semiconductor devices6%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices4%
C11DDetergent compositions2%
C23FNon-mechanical removal of metallic material from surface2%
G01NInvestigating or analysing materials by determining their chemical or physical properties2%
PatentTitleYear
10,665,502Semiconductor device with an interconnection layer and method of manufacturing the same20209,972,530Method of manufacturing semiconductor device including copper interconnections20189,966,455Method for manufacturing a semiconductor device20189,576,921'Semiconductor device and manufacturing method for the same'20179,508,554'Method of manufacturing semiconductor device'20169,508,646'Semicondutor device with copper plugs having different resistance values'20169,230,909'Semiconductor device and manufacturing method thereof, and mounting method of semiconductor device'20166,837,963'Semiconductor device, method of producing a semiconductor device, and semiconductor substrate cleaning apparatus used for the production method'20056,713,232'Method of manufacturing semiconductor device with improved removal of resist residues'20046,642,142'Substrate cleaning method and method for producing an electronic device'20036,586,145'Method of fabricating semiconductor device and semiconductor device'20036,531,381'Method and apparatus for cleaning semiconductor device and method of fabricating semiconductor device'20036,410,454'Method and apparatus for removing contaminants from the surface of a semiconductor wafer'20026,358,329'Resist residue removal apparatus and method'20026,340,253'Resist peeling system and control method of a resist peeling solution'20026,053,059'Analyzing system of organic substance adhering to a surface of a sample'2000Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2000–2003Patents assigned to MITSUBISHI ELECTRIC CORP (7)· patent assignee history
2000–2020Based in Tokyo, JP· patent location history
2002Based in Chiyoda-ku, JP· patent location history
2003–2005Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (4)· patent assignee history
2003–2005Based in Hyogo, JP· patent location history
2003Based in Itami, JP· patent location history
2004Patents assigned to KAO CORP (1)· patent assignee history
2005Patents assigned to RENESAS TECH CORP (1)· patent assignee history
2016–2020Patents assigned to RENESAS ELECTRONICS CORP (7)· patent assignee history
2016–2018Based in Kanagawa, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUBISHI ELECTRIC CORP | 7 | 2000–2003 |
| RENESAS ELECTRONICS CORP | 7 | 2016–2020 |
| MATSUSHITA ELECTRIC INDUSTRIAL CO LTD | 4 | 2003–2005 |
| KAO CORP | 1 | 2004 |
| RENESAS TECH CORP | 1 | 2005 |
Locations
| Location | Patents | Span |
|---|---|---|
| Tokyo, JP | 8 | 2000–2020 |
| Kanagawa, JP | 3 | 2016–2018 |
| Hyogo, JP | 3 | 2003–2005 |
| Itami, JP | 1 | 2003 |
| Chiyoda-ku, JP | 1 | 2002 |