Inventor
Taizo Eshima
Inventor
Fukuoka, JP
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
Y10Tprimary
Y10TTechnical subjects covered by former us classification31%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%
B25BTools or bench devices not otherwise provided for, for fastening, connecting, disengaging, or holding13%
C23CCoating metallic material13%
H05KPrinted circuits13%
B30BPresses in general6%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h106%
PatentTitleYear
5,976,260'Semiconductor producing apparatus, and wafer vacuum chucking device, gas cleaning method and nitride film forming method in semiconductor producing apparatus'19995,534,073'Semiconductor producing apparatus comprising wafer vacuum chucking device'19965,093,281'method for manufacturing semiconductor devices'19924,923,386'Apparatus for forming leads of a semiconductor device'19904,885,837'Apparatus for forming leads of semiconductor devices'1989Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1989–1999Patents assigned to MITSUBISHI ELECTRIC CORP (5)· patent assignee history
1989–1999Based in Fukuoka, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MITSUBISHI ELECTRIC CORP | 5 | 1989–1999 |
Locations
| Location | Patents | Span |
|---|---|---|
| Fukuoka, JP | 5 | 1989–1999 |