Inventor
Sai Vadlamani
Inventor
Chandler, AZ, US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
H01LSemiconductor devices23%
H10DInorganic electric semiconductor devices19%
H01FMagnets12%
C09DCoating compositions, e.g. paints, varnishes or lacquers4%
G05FSystems for regulating electric or magnetic variables4%
H01RElectrically-conductive connections4%
H05KPrinted circuits4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
PatentTitleYear
10,971,492Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same202110,741,947Plated through hole socketing coupled to a solder ball to engage with a pin202010,700,021Coreless organic packages with embedded die and magnetic inductor structures202010,692,9653D conductive ink printing method and inductor formed thereof202010,672,859Embedded magnetic inductor202010,643,994Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same202010,373,951Package-embedded thin-film capacitors, package-integral magnetic inductors, and methods of assembling same2019Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2019–2021Patents assigned to INTEL CORP (7)· patent assignee history
2019–2021Based in Chandler, AZ, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 7 | 2019–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Chandler, AZ, US | 7 | 2019–2021 |