Inventor
CHI-MING YANG
Inventor
TW
Overview
Patents· 37 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices23%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices21%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
C07FAcyclic, carbocyclic or heterocyclic compounds containing elements other than carbon, hydrogen, halogen, oxygen, nitrogen, sulfur, selenium or tellurium5%
C23CCoating metallic material5%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h104%
B24BMachines, devices, or processes for grinding or polishing3%
G01NInvestigating or analysing materials by determining their chemical or physical properties3%
C07BGeneral methods of organic chemistry2%
H01JElectric discharge tubes or discharge lamps2%
PatentTitleYear
12,525,502Semiconductor packaging device and heat dissipation cover thereof202612,494,285Physiological information monitoring system202512,487,523In-situ deposition and densification treatment for metal-comprising resist layer202512,463,034Photoresist layer surface treatment, cap layer, and method of forming photoresist pattern202512,400,915Metrology method202512,321,100Semiconductor lithography system and/or method202512,317,576Method for forming a semiconductor structure using dehydrating chemical, and method for forming a semiconductor structure202512,271,113Method of manufacturing a semiconductor device202512,272,554Method of manufacturing a semiconductor device202512,222,643Method of manufacturing a semiconductor device and pattern formation method202512,159,787Method of manufacturing a semiconductor device and pattern formation method202412,153,346Photoresist for semiconductor fabrication202412,135,501Method of manufacturing a semiconductor device202412,057,315Photoresist layer surface treatment, cap layer, and method of forming photoresist pattern202412,044,966Photoresist for semiconductor fabrication202411,999,027Method for polishing semiconductor substrate202411,921,430Semiconductor lithography system and/or method202411,908,700Method for manufacturing semiconductor structure202411,822,237Method of manufacturing a semiconductor device202311,784,046Method of manufacturing a semiconductor device202311,772,227Device and methods for chemical mechanical polishing202311,767,336Organometallic cluster photoresists for EUV lithography202311,726,405Photoresist for semiconductor fabrication202311,703,524Probing system for discrete wafer202311,705,332Photoresist layer surface treatment, cap layer, and method of forming photoresist pattern202311,655,405Method of manufacturing cerium dioxide powder and cerium dioxide powder202311,658,091Methods of manufacturing semiconductor packaging device and heat dissipation structure202311,652,007Metrology method202311,602,821Wafer polishing head, system thereof, and method using the same202311,579,531Organometallic cluster photoresists for EUV lithography202311,482,422Method for manufacturing semiconductor structure202211,450,586Heat dissipation structure, semiconductor packaging device, and manufacturing method of the semiconductor packaging device202211,402,761Semiconductor lithography system and/or method202211,264,321Semiconductor devices employing a barrier layer202211,255,658Ellipsometer and method for estimating thickness of film202211,199,767Apparatus and method for generating an electromagnetic radiation202111,153,957Apparatus and method for generating an electromagnetic radiation2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (35)· patent assignee history
2021–2026Based in TW· patent location history
2022–2026Patents assigned to GLOBAL UNICHIP CORP (3)· patent assignee history
2023Patents assigned to HERMES TESTING SOLUTIONS INC (1)· patent assignee history
2023Patents assigned to UNIV NAT TAIWAN (1)· patent assignee history
2025Patents assigned to QUANTA COMP INC (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 35 | 2021–2026 |
| GLOBAL UNICHIP CORP | 3 | 2022–2026 |
| HERMES TESTING SOLUTIONS INC | 1 | 2023 |
| QUANTA COMP INC | 1 | 2025 |
| UNIV NAT TAIWAN | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 37 | 2021–2026 |