Inventor
HYEJEONG LEE
Inventor
KR
Overview
Patents· 2 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C08Gprimary
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds11%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients11%
C08LCompositions of macromolecular compounds11%
C09DCoating compositions, e.g. paints, varnishes or lacquers11%
C09KMaterials for miscellaneous applications, not provided for elsewhere11%
G06FElectric digital data processing11%
H01LSemiconductor devices11%
H10HInorganic light-emitting semiconductor devices having potential barriers11%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%
PatentTitleYear
11,926,695High-thermal conductive epoxy compound and composition, material for semiconductor package, molded product, electric and electronic device, and semiconductor package including the same202411,347,705Supporting scalable distributed secondary index using replication engine for high-performance distributed database systems2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022Patents assigned to SAP SE (1)· patent assignee history
2022–2024Based in KR· patent location history
2024Patents assigned to SAMSUNG ELECTRONICS CO LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 1 | 2024 |
| SAP SE | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| KR | 2 | 2022–2024 |