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Inventor

Cheng-Kuan Wu

Inventor
Hsinchu, TW

Overview

3→
Patents
2005–2021
Patent span
Performing operations
Primary field (CPC B)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B22Cprimary
B22CFoundry moulding20%
B22DCasting of metals20%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices20%
H10BElectronic memory devices20%
H10DInorganic electric semiconductor devices20%
PatentTitleYear
10,962,881Method and apparatus for lithography in semiconductor fabrication202110,933,464Forging cast method using thin shell mold20216,909,136'Trench-capacitor DRAM cell having a folded gate conductor'2005

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2005Patents assigned to NANYA TECHNOLOGY CORP (1)· patent assignee history
2005Based in Taipei, TW· patent location history
2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (1)· patent assignee history
2021Patents assigned to WU CHENG KUAN (1)· patent assignee history
2021Based in Hsinchu, TW· patent location history
2021Based in Tainan, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
NANYA TECHNOLOGY CORP12005
TAIWAN SEMICONDUCTOR MFG CO LTD12021
WU CHENG KUANself12021
Locations
LocationPatentsSpan
Hsinchu, TW12021
Tainan, TW12021
Taipei, TW12005