Inventor
Min Cheol An
Inventor
Suwon-si, KR
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1050%
H05KPrinted circuits30%
G06KGraphical data reading10%
Y02PClimate change mitigation technologies in the production or processing of goods10%
PatentTitleYear
6,104,095'Printed circuit board and chip-on-board packages using same'20006,028,774'Base cards and IC cards using the same'20005,804,874'Stacked chip package device employing a plurality of lead on chip type semiconductor chips'19985,744,827'Three dimensional stack package device having exposed coupling lead portions and vertical interconnection elements'19985,450,289'Semiconductor package and a printed circuit board applicable to its mounting'1995Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1995–2000Patents assigned to SAMSUNG ELECTRONICS CO LTD (5)· patent assignee history
1995Based in Kyungki, KR· patent location history
1998–2000Based in Suwon-si, KR· patent location history
2000Based in Kyungki-do, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 5 | 1995–2000 |
Locations
| Location | Patents | Span |
|---|---|---|
| Suwon-si, KR | 3 | 1998–2000 |
| Kyungki-do, KR | 1 | 2000 |
| Kyungki, KR | 1 | 1995 |