Inventor
SEMA ERMEZ
Inventor
US
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C23Cprimary
C23CCoating metallic material21%
H10BElectronic memory devices21%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%
H01LSemiconductor devices17%
PatentTitleYear
12,362,188Method for preventing line bending during metal fill process202512,237,221Nucleation-free tungsten deposition202512,077,858Tungsten deposition202412,060,639Rapid flush purging during atomic layer deposition202411,355,345Method for preventing line bending during metal fill process2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to LAM RES CORP (5)· patent assignee history
2022–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LAM RES CORP | 5 | 2022–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 5 | 2022–2025 |