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Inventor

Wen-Koi Lai

Inventor
Hsinchu, TW

Overview

3→
Patents
2001–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Dprimary
H10DInorganic electric semiconductor devices40%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices20%
G06FElectric digital data processing20%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
PatentTitleYear
10,846,456Integrated circuit modeling methods and systems20207,250,332'Method for fabricating a semiconductor device having improved hot carrier immunity ability'20076,255,203'Technique for low-temperature formation of excellent silicided .alpha.-Si gate structures'2001

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2001Patents assigned to NAT SCIENCE COUNCIL (1)· patent assignee history
2001–2020Based in Hsinchu, TW· patent location history
2007Patents assigned to UNITED MICROELECTRONICS CORP (1)· patent assignee history
2007Based in Taichung, TW· patent location history
2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (1)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
NAT SCIENCE COUNCIL12001
TAIWAN SEMICONDUCTOR MFG CO LTD12020
UNITED MICROELECTRONICS CORP12007
Locations
LocationPatentsSpan
Hsinchu, TW22001–2020
Taichung, TW12007