Inventor
YU-CHEN CHAN
Inventor
TW
Overview
Patents· 16 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices48%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1048%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h103%
PatentTitleYear
12,525,538Semiconductor device structure and methods of forming the same202612,525,531Protection liner on interconnect wire to enlarge processing window for overlying interconnect via202612,417,981Semiconductor device including graphene interconnect and method of making the semiconductor device202512,211,740Interconnect structure and methods of forming the same202512,113,021Graphene-assisted low-resistance interconnect structures and methods of formation thereof202412,068,254Interconnection structure and methods of forming the same202412,068,253Semiconductor structure with two-dimensional conductive structures202412,051,645Two 2D capping layers on interconnect conductive structure to increase interconnect structure reliability202412,027,419Semiconductor device including liner structure202411,948,837Semiconductor structure having vertical conductive graphene and method for forming the same202411,908,794Protection liner on interconnect wire to enlarge processing window for overlying interconnect via202411,710,700Graphene-assisted low-resistance interconnect structures and methods of formation thereof202311,670,595Semiconductor device structure and methods of forming the same202311,640,940Methods of forming interconnection structure including conductive graphene layers202311,532,549Two 2D capping layers on interconnect conductive structure to increase interconnect structure reliability202211,309,241Protection liner on interconnect wire to enlarge processing window for overlying interconnect via2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (16)· patent assignee history
2022–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 16 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 16 | 2022–2026 |