Inventor

MATTHIAS STENDER

Inventor

Overview

3→

Patents

2023–2024

Patent span

Electricity

Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C09Gprimary

C09GPolishing compositions14%

C09KMaterials for miscellaneous applications, not provided for elsewhere14%

H01LSemiconductor devices14%

H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%

B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts7%

B29LIndexing scheme associated with subclass b29c, relating to particular articles7%

E03FSewers7%

E21DShafts7%

F16LPipes7%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h107%

PatentTitleYear

11,884,859Tungsten chemical mechanical planarization (CMP) with low dishing and low erosion topography2024 11,643,599Tungsten chemical mechanical polishing for reduced oxide erosion2023 11,592,128Sealing profile for embedding into a moulding of curable material2023

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2023–2024Patents assigned to VERSUM MAT US LLC (2)· patent assignee history

2023Patents assigned to DAETWYLER SEALING TECH DEUTSCHLAND GMBH (1)· patent assignee history

2023–2024Based in US· patent location history

2023Based in DE· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
VERSUM MAT US LLC	2	2023–2024
DAETWYLER SEALING TECH DEUTSCHLAND GMBH	1	2023

Locations

Location	Patents	Span
US	2	2023–2024
DE	1	2023