Inventor

Kevin M. O'Connell

Inventor

Rochester, MN, US

Overview

38→

Patents

2014–2021

Patent span

Electricity

Primary field (CPC H)

Patents· 38 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary

H05KPrinted circuits21%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1015%

H01LSemiconductor devices13%

G06FElectric digital data processing7%

G02BOptical elements, systems or apparatus4%

B65DContainers for storage or transport of articles or materials, e.g. bags, barrels, bottles, boxes, cans, cartons, crates, drums, jars, tanks, hoppers, forwarding containers3%

A47BTables2%

B23KSoldering or unsoldering2%

C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients2%

C09KMaterials for miscellaneous applications, not provided for elsewhere2%

PatentTitleYear

11,010,915Three-dimensional (3D) depth imaging systems and methods for dynamic container auto-configuration2021 10,798,829Implementing backdrilling elimination utilizing anti-electroplate coating2020 10,750,623Forming conductive vias using healing layer2020 10,739,832Airflow projection for heat transfer device2020 10,738,903Microfluidic relief valve2020 10,650,098Content analyzer and recommendation tool2020 10,531,576Implementing backdrilling elimination utilizing via plug during electroplating2020 10,383,216Tamper detection circuits2019 10,331,911Secure crypto module including security layers2019 10,299,366Tamper detection circuits2019 10,253,157Shape memory thermal interface materials2019 10,231,356Cold plate2019 10,076,045Implementing backdrilling elimination utilizing anti-electroplate coating2018 10,045,437Mitigation of warping of electronic components2018 9,992,900Electronic equipment divider assembly2018 9,974,202Electronic equipment divider assembly2018 9,940,920Managing a set of devices using a set of acoustic emission data2018 9,937,662Shape memory thermal interface materials2018 9,915,316'Pallet design for vibration mitigation'2018 9,894,801'Cold plate'2018 9,873,774Shape memory thermal interface materials2018 9,872,399'Implementing backdrilling elimination utilizing anti-electroplate coating'2018 9,872,398'Implementing backdrilling elimination utilizing via plug during electroplating'2018 9,732,821'Pallet design for vibration mitigation'2017 9,726,837'Light pipe connector apparatus'2017 9,721,855'Alignment of three dimensional integrated circuit components'2017 9,508,614'Alignment of three dimensional integrated circuit components'2016 9,494,752'Dual optical and electrical LGA contact'2016 9,482,833'Light pipe connector apparatus'2016 9,414,526'Cooling apparatus with dynamic load adjustment'2016 9,414,527'Thermal spreading for an externally pluggable electronic module'2016 9,414,528'Thermal spreading for an externally pluggable electronic module'2016 9,389,379'Dual optical and electrical LGA contact'2016 9,392,731'Cooling apparatus with dynamic load adjustment'2016 9,299,591'Implementing integrated circuit chip attach in three dimensional stack using vapor deposited solder Cu pillars'2016 9,299,686'Implementing integrated circuit chip attach in three dimensional stack using vapor deposited solder Cu pillars'2016 8,779,585'Implementing enhanced thermal conductivity in stacked modules'2014 8,716,597'Implementing enhanced dimensional stability with graphite nanotube hybrid socket'2014

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2014–2020Patents assigned to IBM (35)· patent assignee history

2014Patents assigned to O'CONNELL KEVIN M (2)· patent assignee history

2014Patents assigned to SINHA ARVIND K (2)· patent assignee history

2014Patents assigned to MANN PHILLIP V (1)· patent assignee history

2014–2020Based in Rochester, MN, US· patent location history

2016Patents assigned to GLOBALFOUNDRIES INC (2)· patent assignee history

2021Based in Palatine, IL, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
IBM	35	2014–2020
GLOBALFOUNDRIES INC	2	2016
O'CONNELL KEVIN Mself	2	2014
SINHA ARVIND K	2	2014
MANN PHILLIP V	1	2014

Locations

Location	Patents	Span
Rochester, Minnesota, US	37	2014–2020
Palatine, Illinois, US	1	2021