Inventor

Paul Smith

Inventor
San Jose, CA, US

Overview

28→
Patents
1976–2017
Patent span
Electricity
Primary field (CPC H)

Patents· 28 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

C23Cprimary
C23CCoating metallic material19%
H01JElectric discharge tubes or discharge lamps17%
G06FElectric digital data processing13%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests11%
C25DProcesses for the electrolytic or electrophoretic production of coatings6%
G01BMeasuring length, thickness or similar linear dimensions6%
H04LTransmission of digital information, e.g. telegraphic communication6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h106%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h104%
A61HPhysical therapy apparatus, e.g. devices for locating or stimulating reflex points in the body2%
PatentTitleYear
9,740,708'Systems and methods for distance and performance based load balancing'20179,584,551'SIP user release'20179,413,670'SIP load balancing'20168,857,832'Knee-walker'20148,776,015'Pattern modeling methods and systems'20148,525,813'Multi-point interface for a graphical modeling environment'20138,519,979'Multi-point interface for a graphical modeling environment'20138,336,025'Pattern modeling methods and systems'20127,930,160'Electronic markup of executable models'20117,777,483'Method and apparatus for measuring a thickness of a layer of a wafer'20107,355,394'Apparatus and method of dynamically measuring thickness of a layer of a substrate'20087,112,961'Method and apparatus for dynamically measuring the thickness of an object'20067,026,238'Reliability barrier integration for Cu application'20066,893,548'Method of conditioning electrochemical baths in plating technology'20056,753,248'Post metal barrier/adhesion film'20046,705,246'RF powered plasma enhanced chemical vapor deposition reactor and methods of effecting plasma enhanced chemical vapor deposition'20046,533,894'RF powered plasma enhanced chemical vapor deposition reactor and methods of effecting plasma enhanced chemical vapor deposition'20036,395,128'RF powered plasma enhanced chemical vapor deposition reactor and methods of effecting plasma enhanced chemical vapor deposition'20026,350,320'Heater for processing chamber'20026,258,223'In-situ electroless copper seed layer enhancement in an electroplating system'20016,235,646'RF powered plasma enhanced chemical vapor deposition reactor and methods of effecting plasma enhanced chemical vapor deposition'20016,227,141'RF powered plasma enhanced chemical vapor deposition reactor and methods'20016,159,867'RF powered plasma enhanced chemical vapor deposition reactor and methods of effecting plasma enhanced chemical vapor deposition'20006,112,697'RF powered plasma enhanced chemical vapor deposition reactor and methods'20005,983,906'Methods and apparatus for a cleaning process in a high temperature, corrosive, plasma environment'19995,671,141'Computer program architecture for onboard vehicle diagnostic system'19974,397,428'Tape drive having improved reel hub'19833,997,024'Portable scaffold ladder'1976

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1976–2014Patents assigned to SMITH PAUL F (5)· patent assignee history
1999–2010Patents assigned to APPLIED MATERIALS INC (16)· patent assignee history
1999–2010Based in San Jose, CA, US· patent location history
2000–2004Patents assigned to MICRON TECHNOLOGY INC (7)· patent assignee history
2005–2008Based in Campbell, CA, US· patent location history
2011–2014Patents assigned to MATHWORKS INC (5)· patent assignee history
2011–2014Based in Milan, MI, US· patent location history
2012–2014Patents assigned to HOSAGRAHARA ARVIND S (4)· patent assignee history
2016–2017Based in Norton, MA, US· patent location history
2017Based in Guernsey, GB· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
APPLIED MATERIALS INC161999–2010
MICRON TECHNOLOGY INC72000–2004
MATHWORKS INC52011–2014
SMITH PAUL Fself51976–2014
HOSAGRAHARA ARVIND S42012–2014
Locations
LocationPatentsSpan
San Jose, California, US131999–2010
Milan, MI, US52011–2014
Campbell, California, US32005–2008
Norton, Massachusetts, US22016–2017
Guernsey, GB12017