Inventor
Naresh Kumar Penta
Inventor
Newark, DE, US
Overview
Patents· 14 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C09Gprimary
C09GPolishing compositions21%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%
C09KMaterials for miscellaneous applications, not provided for elsewhere18%
H01LSemiconductor devices18%
B24BMachines, devices, or processes for grinding or polishing12%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h104%
Y02PClimate change mitigation technologies in the production or processing of goods3%
B81CProcesses or apparatus specially adapted for the manufacture or treatment of microstructural devices or systems1%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds1%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients1%
PatentTitleYear
10,954,411Chemical mechanical polishing composition and method of polishing silicon nitride over silicon dioxide and simultaneously inhibiting damage to silicon dioxide202110,822,524Aqueous compositions of low dishing silica particles for polysilicon polishing202010,787,592Chemical mechanical polishing compositions and methods having enhanced defect inhibition and selectively polishing silicon nitride over silicon dioxide in an acid environment202010,711,158Aqueous silica slurry and amine carboxylic acid compositions for use in shallow trench isolation and methods of using them202010,626,298Chemical mechanical polishing compositions and methods for suppressing the removal rate of amorphous silicon202010,584,265Aqueous silica slurry and amine carboxylic acid compositions selective for nitride removal in polishing and methods of using them202010,508,221Aqueous low abrasive silica slurry and amine carboxylic acid compositions for use in shallow trench isolation and methods of making and using them201910,316,218Aqueous silica slurry compositions for use in shallow trench isolation and methods of using them201910,221,336Aqueous silica slurry compositions for use in shallow trench isolation and methods of using them201910,119,048Low-abrasive CMP slurry compositions with tunable selectivity20189,150,759'Chemical mechanical polishing composition for polishing silicon wafers and related methods'20158,801,959'Stable, concentratable silicon wafer polishing composition and related methods'20148,795,548'Silicon wafer polishing composition and related methods'20148,778,203'Tunable polish rates by varying dissolved oxygen content'2014Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2014–2015Patents assigned to ROHM & HAAS ELECT MAT (3)· patent assignee history
2014Patents assigned to DANDU P R VEERA (1)· patent assignee history
2014Patents assigned to LAGUDU UMA RAMES KRISHNA (1)· patent assignee history
2014–2021Based in Newark, DE, US· patent location history
2014Based in Potsdam, NY, US· patent location history
2018–2021Patents assigned to ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC (10)· patent assignee history
2020Patents assigned to ROHM AND HAAS ELECTRONIC MAT CMP HOLDINGS I (2)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ROHM & HAAS ELECT MATERIALS CMP HOLDINGS INC | 10 | 2018–2021 |
| ROHM & HAAS ELECT MAT | 3 | 2014–2015 |
| ROHM AND HAAS ELECTRONIC MAT CMP HOLDINGS I | 2 | 2020 |
| DANDU P R VEERA | 1 | 2014 |
| LAGUDU UMA RAMES KRISHNA | 1 | 2014 |
Locations
| Location | Patents | Span |
|---|---|---|
| Newark, Delaware, US | 13 | 2014–2021 |
| Potsdam, New York, US | 1 | 2014 |