Inventor
Donald T. Campbell
Inventor
Campbell, CA, US
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
Y02PClimate change mitigation technologies in the production or processing of goods25%
Y10TTechnical subjects covered by former us classification25%
PatentTitleYear
5,880,017'Method of bumping substrates by contained paste deposition'19995,672,542'Method of making solder balls by contained paste deposition'19975,586,715'Method of making solder balls by contained paste deposition'19965,539,153'Method of bumping substrates by contained paste deposition'1996Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1996–1999Patents assigned to HEWLETT PACKARD CO (4)· patent assignee history
1996–1999Based in Campbell, CA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HEWLETT PACKARD CO | 4 | 1996–1999 |
Locations
| Location | Patents | Span |
|---|---|---|
| Campbell, California, US | 4 | 1996–1999 |