Inventor
Kwang-Ho Chun
Inventor
Asan-si, KR
Overview
Patents· 6 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1043%
H05KPrinted circuits29%
Y02PClimate change mitigation technologies in the production or processing of goods21%
G06FElectric digital data processing7%
PatentTitleYear
7,705,449'Cooling apparatus for memory module'20107,675,176'Semiconductor package and module printed circuit board for mounting the same'20107,606,035'Heat sink and memory module using the same'20097,518,873'Heat spreader, semiconductor package module and memory module having the heat spreader'20097,215,026'Semiconductor module and method of forming a semiconductor module'20077,005,735'Array printed circuit board'2006Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2006–2010Patents assigned to SAMSUNG ELECTRONICS CO LTD (5)· patent assignee history
2006–2010Based in Asan-si, KR· patent location history
2007Patents assigned to SAMSUNG ELECTONICS CO LTD (1)· patent assignee history
2009–2010Based in Chungcheongnam-do, KR· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SAMSUNG ELECTRONICS CO LTD | 5 | 2006–2010 |
| SAMSUNG ELECTONICS CO LTD | 1 | 2007 |
Locations
| Location | Patents | Span |
|---|---|---|
| Asan-si, KR | 4 | 2006–2010 |
| Chungcheongnam-do, KR | 2 | 2009–2010 |