Inventor
Guenther Waitl
Inventor
Regensburg, DE
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Hprimary
H10HInorganic light-emitting semiconductor devices having potential barriers23%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation17%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1013%
H05KPrinted circuits9%
Y02PClimate change mitigation technologies in the production or processing of goods9%
C09KMaterials for miscellaneous applications, not provided for elsewhere6%
G02BOptical elements, systems or apparatus6%
H05BElectric heating6%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds2%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients2%
PatentTitleYear
7,288,831'Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof'20077,115,217'Phosphor for light sources and associated light source'20067,102,212'Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof'20067,063,807'Phosphor for light sources and associated light source'20067,005,311'Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof'20066,716,673'Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof'20046,669,866'Luminous substance for a light source and light source associates therewith'20036,432,745'Two-pole SMT miniature housing for semiconductor components and method for the manufacture thereof'20025,492,981'Casting resin of epoxyalkylsiloxane, epoxy resin and anhyride'19965,040,868'Surface-mountable opto-component'19915,027,995'Process for bonding semiconductor chips to substrates'19914,940,855'Hermetically tight glass-metal housing for semiconductor components and method for producing same'19904,875,750'Optoelectronic coupling element and method for its manufacture'19894,810,277'Method for fastening a glass fiber to a light wave guide component'19894,095,116'Electro-optical coupling element'1978Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1978–2004Patents assigned to SIEMENS AG (9)· patent assignee history
1978Based in Munich, DE· patent location history
1989–2007Based in Regensburg, DE· patent location history
1990Patents assigned to ELECTROVAC (1)· patent assignee history
2003–2006Patents assigned to OSRAM OPTO SEMICONDUCTORS GMBH (3)· patent assignee history
2003Patents assigned to PATENT TREUHAND GES FUER ELEKTRISCHE GLUEHLAMPEN MBH (1)· patent assignee history
2006–2007Patents assigned to OSRAM GMBH (3)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| SIEMENS AG | 9 | 1978–2004 |
| OSRAM GMBH | 3 | 2006–2007 |
| OSRAM OPTO SEMICONDUCTORS GMBH | 3 | 2003–2006 |
| ELECTROVAC | 1 | 1990 |
| PATENT TREUHAND GES FUER ELEKTRISCHE GLUEHLAMPEN MBH | 1 | 2003 |
Locations
| Location | Patents | Span |
|---|---|---|
| Regensburg, DE | 14 | 1989–2007 |
| Munich, DE | 1 | 1978 |