Inventor

Toru Ishida

Inventor

Hirakata, JP

Overview

29→

Patents

1978–2007

Patent span

Chemistry

Primary field (CPC C)

Patents· 29 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary

H05KPrinted circuits11%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1011%

C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds8%

C09DCoating compositions, e.g. paints, varnishes or lacquers8%

Y10TTechnical subjects covered by former us classification8%

C04BLime, magnesia7%

H01BCables7%

H01CResistors5%

C08LCompositions of macromolecular compounds4%

Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests4%

PatentTitleYear

7,199,469'Semiconductor device having stacked semiconductor chips sealed with a resin seal member'2007 7,183,356'Fluororesin powder coating composition'2007 7,144,948'Processes for producing a fluororesin powder having curable functional groups and its coating composition'2006 6,820,179'Semiconductor device and data processing system'2004 6,806,333'Aqueous dispersion of fluorocopolymer'2004 6,783,211'Ink-jet recording head'2004 6,610,788'Aqueous dispersion of fluorocopolymer and composition for water-based coating material'2003 6,465,082'Stress relaxation electronic part, stress relaxation wiring board, and stress relaxation electronic part mounted body'2002 6,461,719'Agricultural covering material'2002 6,002,011'Crystals of benzimidazole derivatives and their production'1999 5,962,612'Fluorine-containing copolymer having rings on its main chain'1999 5,557,245'Strip line-type high-frequency element'1996 5,447,982'Process for preparing an aqueous dispersion, aqueous dispersion and aqueous coating composition'1995 5,406,459'Surface mounting module for an electric circuit board'1995 5,235,091'Process for preparing diphenylmethane compounds'1993 5,090,119'Method of forming an electrical contact bump'1992 5,014,111'Electrical contact bump and a package provided with the same'1991 5,004,715'Dielectric ceramic composition and a multilayer ceramic capacitor and a method of manufacturing a multilayer ceramic capacitor'1991 4,949,065'Resistor composition, resistor produced therefrom, and method of producing resistor'1990 4,943,666'Process for producing nitrophenol compound'1990 4,863,683'Conductor paste and method of manufacturing a multilayered ceramic body using the paste'1989 4,812,422'Dielectric paste and method of manufacturing the paste'1989 4,795,512'Method of manufacturing a multilayer ceramic body'1989 4,732,798'Multilayer ceramic substrate and method of making the same'1988 4,714,570'Conductor paste and method of manufacturing a multilayered ceramic body using the paste'1987 4,695,403'Thick film conductor composition'1987 4,695,504'Thick film resistor composition'1987 4,323,484'Glaze resistor composition'1982 4,119,573'Glaze resistor composition and method of making the same'1978

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1978–2004Patents assigned to MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (16)· patent assignee history

1978–2004Based in Hirakata, JP· patent location history

1990–1999Patents assigned to TAKEDA CHEMICAL INDUSTRIES LTD (3)· patent assignee history

1993–1999Based in Takarazuka, JP· patent location history

1995–2007Patents assigned to ASAHI GLASS CO LTD (7)· patent assignee history

1995–1999Based in Yokohama, JP· patent location history

1996Patents assigned to HITACHI METALS LTD (1)· patent assignee history

2004–2007Patents assigned to HITACHI HOKKAI SEMICONDUCTOR (2)· patent assignee history

2004–2007Based in Chiba, JP· patent location history

2004–2007Based in Tama, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
MATSUSHITA ELECTRIC INDUSTRIAL CO LTD	16	1978–2004
ASAHI GLASS CO LTD	7	1995–2007
TAKEDA CHEMICAL INDUSTRIES LTD	3	1990–1999
HITACHI HOKKAI SEMICONDUCTOR	2	2004–2007
HITACHI METALS LTD	1	1996

Locations

Location	Patents	Span
Hirakata, JP	16	1978–2004
Chiba, JP	3	2004–2007
Tama, JP	2	2004–2007
Takarazuka, JP	2	1993–1999
Yokohama, JP	2	1995–1999