Inventor
Kelvin Aik Boo TAN
Inventor
SG
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices36%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
H10BElectronic memory devices14%
H01GCapacitors7%
H10DInorganic electric semiconductor devices7%
PatentTitleYear
12,593,706Multi-chip package with enhanced conductive layer adhesion202612,588,527Dielectric interposer with electrical-connection cut-in202612,500,186Capacitor having electrodes formed within a substrate202512,476,216Wire bonding for stacked memory dies202512,463,140Flexible interposer for semiconductor dies2025Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2025–2026Patents assigned to MICRON TECHNOLOGY INC (5)· patent assignee history
2025–2026Based in SG· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 5 | 2025–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| SG | 5 | 2025–2026 |