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Inventor

Marcus E. Interrante

Inventor
New Paltz, NY, US

Overview

10→
Patents
2013–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 10 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1043%
H01LSemiconductor devices39%
B23KSoldering or unsoldering9%
H05KPrinted circuits4%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h104%
PatentTitleYear
10,978,314Multi integrated circuit chip carrier package202110,832,987Managing thermal warpage of a laminate202010,804,181Heterogeneous thermal interface material for corner and or edge degradation mitigation202010,541,156Multi integrated circuit chip carrier package20209,583,408'Reducing directional stress in an orthotropic encapsulation member of an electronic package'20179,401,315'Thermal hot spot cooling for semiconductor devices'20169,293,439'Electronic module assembly with patterned adhesive array'20169,224,712'3D bond and assembly process for severely bowed interposer die'20159,093,563'Electronic module assembly with patterned adhesive array'20158,444,043'Uniform solder reflow fixture'2013

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2013–2021Patents assigned to IBM (8)· patent assignee history
2013Patents assigned to BERNIER WILLIAM E (1)· patent assignee history
2013Patents assigned to INTERRANTE MARCUS E (1)· patent assignee history
2013Patents assigned to KUMAR RAJNEESH (1)· patent assignee history
2013–2017Based in New Paltz, NY, US· patent location history
2016Patents assigned to GLOBALFOUNDRIES INC (2)· patent assignee history
2020–2021Based in Ulster, NY, US· patent location history
2020Based in Highland, NY, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
IBM82013–2021
GLOBALFOUNDRIES INC22016
BERNIER WILLIAM E12013
INTERRANTE MARCUS Eself12013
KUMAR RAJNEESH12013
Locations
LocationPatentsSpan
New Paltz, New York, US62013–2017
Ulster, New York, US22020–2021
Highland, New York, US22020