Inventor
ERICA FUNG
Inventor
US
Overview
Patents· 12 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B29Cprimary
B29CShaping or joining of plastics22%
B29KIndexing scheme associated with subclasses b29b, b29c or b29d, relating to moulding materials or to materials for moulds, reinforcements, fillers or preformed parts, e.g. inserts22%
B33YAdditive manufacturing, i.e. manufacturing of three-dimensional [3d] objects by additive deposition, additive agglomeration or additive layering, e.g. by 3d printing, stereolithography or selective laser sintering22%
C09DCoating compositions, e.g. paints, varnishes or lacquers13%
C08LCompositions of macromolecular compounds7%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients5%
C08GMacromolecular compounds obtained otherwise than by reactions only involving unsaturated carbon-to-carbon bonds4%
C08JWorking-up4%
C08FMacromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds2%
PatentTitleYear
12,187,873Three-dimensional printing202512,110,362Three-dimensional printing202412,049,0413-D printing202411,780,988Three-dimensional printing202311,718,0243-D printing202311,628,619Three-dimensional printing202311,613,670Three-dimensional printing202311,591,486Three-dimensional printing202311,590,696Three-dimensional printing202311,426,931Three-dimensional printing202211,298,876Three-dimensional printing202211,235,5213-D printing2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2025Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (12)· patent assignee history
2022Patents assigned to HEWLETT PACKARD DEVELOPMENT LP (1)· patent assignee history
2022–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| HEWLETT PACKARD DEVELOPMENT CO | 12 | 2022–2025 |
| HEWLETT PACKARD DEVELOPMENT LP | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 12 | 2022–2025 |