LexDanaLexDanabeta
Inventor

Meng-Liang Lin

Inventor
Hsinchu, TW

Overview

4→
Patents
2016–2020
Patent span
Electricity
Primary field (CPC H)

Patents· 4 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H01Lprimary
H01LSemiconductor devices36%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1036%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1027%
PatentTitleYear
10,804,254Fan-out package with cavity substrate202010,790,162Integrated circuit package and method202010,446,522Methods of forming multiple conductive features in semiconductor devices in a same formation process20199,343,419'Bump structures for semiconductor package'2016

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2016Patents assigned to TAIWAN SEMICONDUCTOR MFG (1)· patent assignee history
2016–2020Based in Hsinchu, TW· patent location history
2019–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (3)· patent assignee history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
TAIWAN SEMICONDUCTOR MFG CO LTD32019–2020
TAIWAN SEMICONDUCTOR MFG12016
Locations
LocationPatentsSpan
Hsinchu, TW42016–2020