Inventor
HIDEKAZU OKAMOTO
Inventor
JP
Overview
Patents· 8 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
C09Kprimary
C09KMaterials for miscellaneous applications, not provided for elsewhere20%
B08BCleaning in general14%
C09DCoating compositions, e.g. paints, varnishes or lacquers14%
C11DDetergent compositions14%
C07CAcyclic or carbocyclic compounds9%
B05DProcesses for applying fluent materials to surfaces, in general6%
C08BPolysaccharides6%
C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients6%
F25BRefrigeration machines, plants or systems6%
C23GCleaning or de-greasing of metallic material by chemical methods other than electrolysis3%
PatentTitleYear
12,516,231Working fluid for heat cycle, composition for heat cycle system and heat cycle system202611,827,831Fluid composition, refrigerant composition and air conditioner202311,718,574Solvent composition, cleaning method, method of forming a coating film, heat transfer fluid, and heat cycle system202311,440,862Solvent composition, cleaning method, method of forming a coating film, heat transfer fluid, and heat cycle system202211,427,521Solvent composition, cleaning method, method of forming a coating film, heat transfer fluid, and heat cycle system202211,401,486Solvent composition, cleaning method and method of forming a coating film202211,339,314Composition for heat cycle system, and heat cycle system202211,254,824Solvent composition, cleaning method, method for producing substrate with coating film, and heat transfer fluid2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to AGC INC (8)· patent assignee history
2022–2026Based in JP· patent location history
2023Patents assigned to AIST (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| AGC INC | 8 | 2022–2026 |
| AIST | 1 | 2023 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 8 | 2022–2026 |