Inventor
ALEXANDER HEINRICH
Inventor
DE
Overview
Patents· 37 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1023%
H01LSemiconductor devices22%
B23KSoldering or unsoldering10%
A61MDevices for introducing media into, or onto, the body8%
B60RVehicles, vehicle fittings, or vehicle parts, not otherwise provided for5%
H10DInorganic electric semiconductor devices5%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
G16HHealthcare informatics, i.e. information and communication technology [ict] specially adapted for the handling or processing of medical or healthcare data4%
B22FWorking metallic powder3%
G07CTime or attendance registers3%
PatentTitleYear
D1121813Grip for a medical injector202612,581,981Method of forming an interconnection between an electric component and an electronic component202612,465,695Data collection apparatus for attachment to an injection device202512,347,805Inkjet printing of diffusion solder202512,330,243Method of forming an intermetallic phase layer with a plurality of nickel particles202512,261,144Semiconductor device and method for fabricating a semiconductor device202512,255,168Electronic device with multi-layer contact and system202512,205,870Semiconductor package and method for fabricating a semiconductor package202512,166,005Semiconductor device having a soldered joint with one or more intermetallic phases202412,064,606Data collection apparatus for attachment to an injection device202412,069,802Pre-plating of solder layer on solderable elements for diffusion soldering202412,027,490Semiconductor device and method for fabricating the same202412,023,762Layer structure with an intermetallic phase layer and a chip package that includes the layer structure202411,944,796Data collection apparatus for attachment to an injection device202411,865,313Data collection apparatus for attachment to an injection device202411,862,600Method of forming a chip package and chip package202411,842,975Electronic device with multi-layer contact and system202311,817,417Semiconductor device and method for fabricating a semiconductor device202311,776,927Semiconductor device including a solder compound containing a compound Sn/Sb202311,730,891Data collection apparatus for attachment to an injection device202311,688,670Semiconductor package and method for fabricating a semiconductor package202311,652,084Flat lead package formation method202311,605,608Preform diffusion soldering202311,584,200Arrangement for operating one or more windows installed in a vehicle202311,547,806Data collection apparatus for attachment to an injection device202311,552,042Solder material with two different size nickel particles202311,518,341Method for controlling a locking element of a vehicle202211,511,047Data collection apparatus for attachment to an injection device202211,508,694Chip assembly202211,451,941Position-based access verification method202211,450,642Soldering a conductor to an aluminum metallization202211,439,762Data collection apparatus for attachment to an injection device202211,424,217Soldering a conductor to an aluminum layer202211,302,668Multi-purpose non-linear semiconductor package assembly line202211,217,047Method for verifying a predefined maximum spatial distance of a radio key in relation to a motor vehicle, as well as control device, motor vehicle and radio key202211,192,525Access arrangement for a vehicle202111,158,602Batch diffusion soldering and electronic devices produced by batch diffusion soldering2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to INFINEON TECHNOLOGIES AUSTRIA AG (9)· patent assignee history
2021–2023Patents assigned to CONTINENTAL AUTOMOTIVE GMBH (5)· patent assignee history
2021–2026Based in DE· patent location history
2022–2025Patents assigned to INFINEON TECHNOLOGIES AG (14)· patent assignee history
2022–2024Patents assigned to SANOFI AVENTIS DEUTSCHLAND (7)· patent assignee history
2022–2026Based in CH· patent location history
2025Patents assigned to SANOFI SA (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INFINEON TECHNOLOGIES AG | 14 | 2022–2025 |
| INFINEON TECHNOLOGIES AUSTRIA AG | 9 | 2021–2026 |
| SANOFI AVENTIS DEUTSCHLAND | 7 | 2022–2024 |
| CONTINENTAL AUTOMOTIVE GMBH | 5 | 2021–2023 |
| SANOFI SA | 1 | 2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| DE | 30 | 2021–2026 |
| CH | 7 | 2022–2026 |