Inventor
Ming-Hsi Yeh
Inventor
Hsinchu, TW
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
H10DInorganic electric semiconductor devices19%
B05BSpraying apparatus6%
B05DProcesses for applying fluent materials to surfaces, in general6%
B08BCleaning in general6%
G11CStatic stores6%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests6%
PatentTitleYear
11,133,200Substrate vapor drying apparatus and method202111,114,347Self-protective layer formed on high-k dielectric layers with different materials202111,114,436Metal gate structure and methods thereof202111,101,135Semiconductor device and method of manufacture20215,777,369'Bit-line pull-up circuit or static random access memory (SRAM) devices'1998Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
1998Patents assigned to WINBOND ELECTRONICS CORP (1)· patent assignee history
1998–2021Based in Hsinchu, TW· patent location history
2021Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (4)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 4 | 2021 |
| WINBOND ELECTRONICS CORP | 1 | 1998 |
Locations
| Location | Patents | Span |
|---|---|---|
| Hsinchu, TW | 5 | 1998–2021 |