Inventor
WEI-LUN HSU
Inventor
TW
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
H10DInorganic electric semiconductor devices19%
H04BTransmission13%
F25BRefrigeration machines, plants or systems6%
H01QAntennas, i.e. radio aerials6%
H10BElectronic memory devices6%
PatentTitleYear
12,526,013Establishing method and establishing system of reconfigurable intelligent surface radio frequency model, and receiving power distribution constructing method of simulated electromagnetic field with reconfigurable intelligent surface202612,422,171Refrigeration cycle apparatus202512,284,005Reconfigurable intelligent surface and electromagnetic sensing system based on reconfigurable intelligent surface202511,916,075Integrated circuit structure with semiconductor devices and method of fabricating the same202411,665,888Semiconductor device and method for fabricating the same202311,417,654Integrated circuit structure with semiconductor devices and method of fabricating the same202211,152,320Semiconductor package structure and method of the same2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021Patents assigned to INPAQ TECH CO LTD (1)· patent assignee history
2021–2026Based in TW· patent location history
2022–2024Patents assigned to UNITED MICROELECTRONICS CORP (3)· patent assignee history
2023Patents assigned to FUJIAN JINHUA INTEGRATED CIRCUIT CO LTD (1)· patent assignee history
2025–2026Patents assigned to UNIV NAT CHUNG CHENG (2)· patent assignee history
2025Patents assigned to DAIKIN IND LTD (1)· patent assignee history
2025Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| UNITED MICROELECTRONICS CORP | 3 | 2022–2024 |
| UNIV NAT CHUNG CHENG | 2 | 2025–2026 |
| DAIKIN IND LTD | 1 | 2025 |
| FUJIAN JINHUA INTEGRATED CIRCUIT CO LTD | 1 | 2023 |
| INPAQ TECH CO LTD | 1 | 2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 6 | 2021–2026 |
| JP | 1 | 2025 |