Inventor
Tom E. Pearson
Inventor
Beaverton, OR, US
Overview
Patents· 34 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H05Kprimary
H05KPrinted circuits26%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1019%
Y02PClimate change mitigation technologies in the production or processing of goods13%
Y10TTechnical subjects covered by former us classification13%
G06FElectric digital data processing5%
H01RElectrically-conductive connections4%
G01SRadio direction-finding2%
G08BSignalling systems, e.g. personal calling systems2%
H01LSemiconductor devices2%
H02JElectric power networks2%
PatentTitleYear
11,046,496Protective device for electronic device202110,063,074Electronic wearable device electrode pad with collection well20189,420,700'Inclined photonic chip package for integrated optical transceivers and optical touchscreen assemblies'20169,367,174'Wireless peripheral data transmission for touchscreen displays'20169,263,621'Inclined photonic chip package for integrated optical transceivers and optical touchscreen assemblies'20168,901,476'Temporal based motion sensor reporting'20148,525,099'Temporal based motion sensor reporting'20137,251,880'Method and structure for identifying lead-free solder'20077,230,317'Capacitor placement for integrated circuit packages'20077,185,799'Method of creating solder bar connections on electronic packages'20077,183,496'Soldered heat sink anchor and method of use'20077,161,238'Structural reinforcement for electronic substrate'20077,131,193'Heat-shrinkable retainer for PCB double-sided assembly'20067,122,891'Ceramic embedded wireless antenna'20067,036,217'Methods of manufacturing via intersect pad for electronic components'20066,917,524'Extension mechanism and method for assembling overhanging components'20056,906,921'Channeled heat dissipation device and a method of fabrication'20056,906,268'Heat-shrinkable retainer for PCB double-sided assembly'20056,903,271'Electronic assembly with thermally separated support'20056,884,939'Constructing of an electronic assembly having a decoupling capacitor'20056,875,931'Retainer for circuit board assembly and method for using the same'20056,817,878'Zero mounting force solder-free connector/component and method'20046,801,436'Extension mechanism and method for assembling overhanging components'20046,791,189'Epoxy washer for retention of inverted SMT components'20046,764,325'Zero insertion force heat-activated retention pin'20046,747,873'Channeled heat dissipation device and a method of fabrication'20046,734,371'Soldered heat sink anchor and method of use'20046,700,800'Retainer for circuit board assembly and method for using the same'20046,691,407'Methods for retaining assembled components'20046,651,869'Methods and electronic board products utilizing endothermic material for filling vias to absorb heat during wave soldering'20036,509,530'Via intersect pad for electronic components and methods of manufacture'20036,501,658'Heatsink mounting with shock absorbers'20026,472,612'Printed circuit board with embedded thermocouple junctions'2002D0456249'Plastic package with pull tab'2002Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2002–2016Patents assigned to INTEL CORP (30)· patent assignee history
2002–2016Based in Beaverton, OR, US· patent location history
2013–2016Patents assigned to PEARSON TOM E (3)· patent assignee history
2013–2014Patents assigned to INTEL GE CARE INNOVATIONS LLC (2)· patent assignee history
2016Patents assigned to CHANG PETER L (1)· patent assignee history
2018–2021Patents assigned to HEWLETT PACKARD DEVELOPMENT CO (2)· patent assignee history
2018–2021Based in Vancouver, WA, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| INTEL CORP | 30 | 2002–2016 |
| PEARSON TOM Eself | 3 | 2013–2016 |
| HEWLETT PACKARD DEVELOPMENT CO | 2 | 2018–2021 |
| INTEL GE CARE INNOVATIONS LLC | 2 | 2013–2014 |
| CHANG PETER L | 1 | 2016 |
Locations
| Location | Patents | Span |
|---|---|---|
| Beaverton, OR, US | 32 | 2002–2016 |
| Vancouver, Washington, US | 2 | 2018–2021 |