Inventor

Edward Chia-Ning Tang

Inventor
Ann Arbor, MI, US

Overview

15→
Patents
2013–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 15 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

A61Nprimary
A61NElectrotherapy20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
H01LSemiconductor devices14%
H05KPrinted circuits10%
A61BDiagnosis6%
G06FElectric digital data processing6%
G01LMeasuring force, stress, torque, work, mechanical power, mechanical efficiency, or fluid pressure4%
G02BOptical elements, systems or apparatus4%
G06TImage data processing or generation, in general4%
G09GArrangements or circuits for control of indicating devices using static means to present variable information4%
PatentTitleYear
11,126,261Display control system and rendering pipeline202110,756,043Method of fabricating implantable medical devices from a polymer coupon that is bonded to a rigid substrate202010,525,258Implantable electrode array assembly including a carrier with packaged control modules202010,514,546Steerable high-resolution display201910,342,971Implantable electrode array assembly with an array substrate, electrodes and packaged integrated circuits201910,303,242Media chair apparatus, system, and method201910,048,145Sensor assembly and method for measuring forces and torques201810,046,158Implantable electrode array assembly with an array substrate, electrodes and integrated circuits, the integrated circuits being attached to package substrates20189,950,154Method of manufacturing an implantable electrode array by forming packages around the array control modules after the control modules are bonded to substrates20189,770,582'Implantable electrode array assembly including a carrier with embedded control modules contained in packages, the packages extending outwardly so as to extend over the carrier'20179,700,262'Method of fabricating implantable medical devices from a polymer coupon that is bonded to rigid substrate'20179,274,014'Sensor assembly and method for measuring forces and torques'20168,951,426'Method of fabricating an implantable medical device that includes one or more thin film polymer support layers'20158,781,600'Implantable electrode array assembly including a carrier in which control modules for regulating the operation of the electrodes are disposed and electrodes that are disposed on top of the carrier'20148,554,340'Implantable electrode array assembly including a carrier, superstrates mounted to the carrier and electrodes disposed on the superstrates'2013

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2013–2020Patents assigned to STRYKER CORP (12)· patent assignee history
2013–2018Patents assigned to BRINDLEY ROB (3)· patent assignee history
2013–2018Patents assigned to JANIK JOHN (3)· patent assignee history
2013–2018Patents assigned to DUNLOP JR JAMES BERNARD (2)· patent assignee history
2013–2020Based in Ann Arbor, MI, US· patent location history
2019–2021Patents assigned to AVEGANT CORP (3)· patent assignee history
2019–2021Based in Menlo Park, CA, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
STRYKER CORP122013–2020
AVEGANT CORP32019–2021
BRINDLEY ROB32013–2018
JANIK JOHN32013–2018
DUNLOP JR JAMES BERNARD22013–2018
Locations
LocationPatentsSpan
Ann Arbor, MI, US122013–2020
Menlo Park, California, US32019–2021