Inventor
Takuo Kisaki
Inventor
Kyoto, JP
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1031%
H01LSemiconductor devices23%
H05KPrinted circuits23%
H03HImpedance networks, e.g. resonant circuits15%
H03BGeneration of oscillations, directly or by frequency-changing, by circuits employing active elements which operate in a non-switching manner8%
PatentTitleYear
11,116,077Wiring board, electronic device, and electronic module202110,832,980Electronic component housing package, multi-piece wiring substrate, electronic apparatus, and electronic module202010,381,281Electronic component housing package, multi-piece wiring substrate, electronic apparatus, and electronic module having curved connection conductors201910,355,665Electronic component housing package, electronic apparatus, and electronic module2019Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2019–2021Patents assigned to KYOCERA CORP (4)· patent assignee history
2019–2020Based in Kyoto, JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| KYOCERA CORP | 4 | 2019–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kyoto, JP | 3 | 2019–2020 |