Inventor

David C. Cheng

Inventor
Taoyuan County, TW

Overview

40→
Patents
1991–2016
Patent span
Electricity
Primary field (CPC H)

Patents· 40 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H05Kprimary
H05KPrinted circuits20%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1017%
H04BTransmission15%
Y10TTechnical subjects covered by former us classification11%
G01SRadio direction-finding6%
G11BInformation storage based on relative movement between record carrier and transducer6%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h105%
B64GCosmonautics3%
H04MTelephonic communication3%
C01BNon-metallic elements2%
PatentTitleYear
9,237,643'Circuit board structure'20168,365,400'Manufacturing process for a circuit board'20138,288,663'Electrical interconnect structure and process thereof and circuit board structure'20128,153,472'Embedded chip package process'20127,888,174'Embedded chip package process'20117,772,703'Package substrate'20107,663,249'Embedded chip package structure'20107,284,323'Process of fabricating conductive column'20077,140,359'Spark plug capable of removing remaining electric charges'20066,963,548'Coherent synchronization of code division multiple access signals'20056,917,358'Resistance inducting wire layout on a touch panel'20056,807,397'Method for identifying growth limits of handheld services for mobile satellite communications'20046,785,553'Position location of multiple transponding platforms and users using two-way ranging as a calibration reference for GPS'20046,766,987'Satellite system and method of deploying same'20046,709,897'Method of forming IC package having upward-facing chip cavity'20046,643,268'Method for re-routing signals in a switch network'20036,638,858'Hole metal-filling method'20036,606,307'Techniques for utilization of bandwidth space assets'20036,506,633'Method of fabricating a multi-chip module package'20036,506,632'Method of forming IC package having downward-facing chip cavity'20036,501,941'Method for identifying growth limits of handheld services for mobile satellite communications'20026,483,672'Track width control of readback elements with ions implantation in a bounding region of tip portion to selectively deactivate magnetic sensitivity thereof'20026,460,808'Satellite system and method of deploying same'20026,353,999'Method of making mechanical-laser structure'20026,336,612'Satellite system and method of deploying same'20026,327,872'Method and apparatus for producing a pressurized high purity liquid carbon dioxide stream'20016,313,790'Method and system for determining a position of a transceiver in a communications network'20016,288,858'Method for improving magnetic recording at high data rates for waveforms having a burst of transitions'20016,257,526'Satellite system and method of deploying same'20016,246,363'Method and system for incorporating two-way ranging navigation as a calibration reference for GPS'20016,229,477'Method and system for determining a position of a communication satellite utilizing two-way ranging'20016,210,746'Method of fabricating a solder resist mask'20016,201,300'Printed circuit board with thermal conductive structure'20016,175,497'Thermal vias-provided cavity-down IC package structure'20016,032,355'Method of forming thermal conductive structure on printed circuit board'20005,822,401'Statistical diagnosis in interactive voice response telephone system'19985,740,233'System and method for statistical diagnosis of the operation of an automated telephone system'19985,483,515'Apparatus and method for cancelling cross-talk in signals from optical data storage systems'19965,402,052'Inductive current switching system with resonance'19955,026,470'Sputtering apparatus'1991

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1991–2002Patents assigned to IBM (5)· patent assignee history
1991–2002Based in Palo Alto, CA, US· patent location history
1998Based in Plano, TX, US· patent location history
2000–2016Based in Taoyuan County, TW· patent location history
2001–2004Patents assigned to HUGHES ELECTRONICS CORP (11)· patent assignee history
2001–2003Patents assigned to UNIMICRON TAIWAN CORP (3)· patent assignee history
2001–2005Based in Palos Verdes Estates, CA, US· patent location history
2003–2016Patents assigned to UNIMICRON TECHNOLOGY CORP (11)· patent assignee history
2012–2013Patents assigned to CHENG DAVID C H (3)· patent assignee history
2013Based in Changhua County, TW· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
HUGHES ELECTRONICS CORP112001–2004
UNIMICRON TECHNOLOGY CORP112003–2016
IBM51991–2002
CHENG DAVID C Hself32012–2013
UNIMICRON TAIWAN CORP32001–2003
Locations
LocationPatentsSpan
Taoyuan County, TW162000–2016
Palos Verdes Estates, California, US122001–2005
Palo Alto, California, US51991–2002
Plano, Texas, US21998
Changhua County, TW12013