Inventor
CHENGHAO WU
Inventor
US
Overview
Patents· 7 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
G03Fprimary
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices29%
H01LSemiconductor devices12%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%
C04BLime, magnesia6%
C09CTreatment of inorganic materials, other than fibrous fillers, to enhance their pigmenting or filling properties6%
C09KMaterials for miscellaneous applications, not provided for elsewhere6%
G06FElectric digital data processing6%
G06NComputing arrangements based on specific computational models6%
G06VImage or video recognition or understanding6%
H04NPictorial communication, e.g. television6%
PatentTitleYear
12,585,184Photoresist with multiple patterning radiation-absorbing elements and/or vertical composition gradient202612,577,466Photoresist development with organic vapor202612,552,712Modified dolomite powder, preparation method thereof and concrete202612,436,464Pre-exposure photoresist curing to enhance EUV lithographic performance202512,211,691Dry development of resists202511,921,427Methods for making hard masks useful in next-generation lithography202411,483,621Big data acquisition and analysis system using intelligent image recognition, and application method thereof2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022Patents assigned to SHANGHAI ILLUMINERA DIGITAL TECH CO LTD (1)· patent assignee history
2022–2026Based in CN· patent location history
2024–2026Patents assigned to LAM RES CORP (5)· patent assignee history
2024–2026Based in US· patent location history
2026Patents assigned to ANHUI ZHONGTIE ENGINEERING MATERIAL TECH CO LTD (1)· patent assignee history
2026Patents assigned to CHINA TIESIJU CIVIL ENG GROUP CO LTD (1)· patent assignee history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| LAM RES CORP | 5 | 2024–2026 |
| ANHUI ZHONGTIE ENGINEERING MATERIAL TECH CO LTD | 1 | 2026 |
| CHINA TIESIJU CIVIL ENG GROUP CO LTD | 1 | 2026 |
| SHANGHAI ILLUMINERA DIGITAL TECH CO LTD | 1 | 2022 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 5 | 2024–2026 |
| CN | 2 | 2022–2026 |