Inventor
Chen-Chao Wang
Inventor
Kaohsiung, TW
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices29%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1029%
H10BElectronic memory devices12%
H10DInorganic electric semiconductor devices12%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1012%
H01QAntennas, i.e. radio aerials6%
PatentTitleYear
10,916,429Semiconductor device packages and stacked package assemblies including high density interconnections202110,903,561Semiconductor device package and method of manufacturing the same202110,903,152Low loss substrate for high data rate applications202110,886,263Stacked semiconductor package assemblies including double sided redistribution layers20219,548,371'Integrated circuits having nickel silicide contacts and methods for fabricating the same'2017Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2017Patents assigned to GLOBALFOUNDRIES SG PTE LTD (1)· patent assignee history
2017Based in Singapore, SG· patent location history
2021Patents assigned to ADVANCED SEMICONDUCTOR ENG (4)· patent assignee history
2021Based in Kaohsiung, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| ADVANCED SEMICONDUCTOR ENG | 4 | 2021 |
| GLOBALFOUNDRIES SG PTE LTD | 1 | 2017 |
Locations
| Location | Patents | Span |
|---|---|---|
| Kaohsiung, TW | 4 | 2021 |
| Singapore, SG | 1 | 2017 |