Inventor
ROBERT DEMBI
Inventor
US
Overview
Patents· 4 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices25%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices19%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%
G01RMeasuring electric variables6%
H10BElectronic memory devices6%
PatentTitleYear
12,230,546Wafer registration and overlay measurement systems and related methods202511,520,240Wafer alignment markers, systems, and related methods202211,251,096Wafer registration and overlay measurement systems and related methods202211,189,526Apparatus comprising staircase structures2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2025Patents assigned to MICRON TECHNOLOGY INC (4)· patent assignee history
2021–2025Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 4 | 2021–2025 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 4 | 2021–2025 |