Inventor

Cathie J. Burke

Inventor

Rochester, NY, US

Overview

45→

Patents

1990–2021

Patent span

Performing operations

Primary field (CPC B)

Patents· 45 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

B41Jprimary

B41JTypewriters54%

Y10TTechnical subjects covered by former us classification10%

H10DInorganic electric semiconductor devices8%

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h108%

H04LTransmission of digital information, e.g. telegraphic communication4%

Y04SSystems integrating technologies related to power network operation, communication or information technologies for improving the electrical power generation, transmission, distribution, management or usage, i.e. smart grids3%

B23KSoldering or unsoldering1%

B24BMachines, devices, or processes for grinding or polishing1%

B29CShaping or joining of plastics1%

G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices1%

PatentTitleYear

11,036,505Store-to-load forwarding2021 8,591,008'Liquid drop ejection using dual feed ejector'2013 8,567,912'Inkjet printing device with composite substrate'2013 8,496,318'Liquid drop ejection using dual feed ejector'2013 7,857,422'Dual feed liquid drop ejector'2010 7,445,315'Thin film and thick film heater and control architecture for a liquid drop ejector'2008 7,183,216'Methods to form oxide-filled trenches'2007 7,048,361'Ink jet apparatus'2006 6,987,348'Piezoelectric transducers'2006 6,955,419'Ink jet apparatus'2005 6,905,196'Polysilicon feed-through fluid drop ejector'2005 6,790,598'Methods of patterning resists and structures including the patterned resists'2004 6,596,644'Methods for forming features in polymer layers'2003 6,440,643'Method of making inkjet print head with patterned photoresist layer having features with high aspect ratios'2002 6,315,398'Thermal ink jet heater design'2001 6,294,317'Patterned photoresist structures having features with high aspect ratios and method of forming such structures'2001 6,227,657'Low topography thermal inkjet drop ejector structure'2001 6,183,069'Ink jet printhead having a patternable ink channel structure'2001 6,146,914'Thermal ink jet printhead with increased heater resistor control'2000 6,109,733'Printhead for thermal ink jet devices'2000 6,102,528'Drive transistor for an ink jet printhead'2000 6,039,436'Thermal ink-jet printhead with lateral thermal insulation for the heating elements'2000 6,013,160'Method of making a printhead having reduced surface roughness'2000 5,980,025'Thermal inkjet printhead with increased resistance control and method for making the printhead'1999 5,969,392'Thermal ink jet printheads with power MOS driver devices having enhanced transconductance'1999 5,943,076'Printhead for thermal ink jet devices'1999 5,933,166'Ink-jet printhead allowing selectable droplet size'1999 5,900,892'Nozzle plates for ink jet cartridges'1999 5,820,771'Method and materials, including polybenzoxazole, for fabricating an ink-jet printhead'1998 5,751,315'Thermal ink-jet printhead with a thermally isolated heating element in each ejector'1998 5,738,799'Method and materials for fabricating an ink-jet printhead'1998 5,729,261'Thermal ink jet printhead with improved ink resistance'1998 5,699,094'Ink jet printing device'1997 5,665,249'Micro-electromechanical die module with planarized thick film layer'1997 5,639,386'Increased threshold uniformity of thermal ink transducers'1997 5,532,901'Office environment level electrostatic discharge protection'1996 5,448,273'Thermal ink jet printhead protective layers'1995 5,428,498'Office environment level electrostatic discharge protection'1995 5,208,606'Directionality of thermal ink jet transducers by front face metalization'1993 5,081,473'Temperature control transducer and MOS driver for thermal ink jet printing chips'1992 5,075,250'Method of fabricating a monolithic integrated circuit chip for a thermal ink jet printhead'1991 5,045,142'Stand-off structure for flipped chip butting'1991 5,010,355'Ink jet printhead having ionic passivation of electrical circuitry'1991 4,999,077'Method of fabricating full width scanning or imaging arrays from subunits'1991 4,947,192'Monolithic silicon integrated circuit chip for a thermal ink jet printer'1990

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1990–2007Patents assigned to XEROX CORP (38)· patent assignee history

1990Based in Brighton, NY, US· patent location history

1991–2013Based in Rochester, NY, US· patent location history

2010–2013Patents assigned to EASTMAN KODAK CO (4)· patent assignee history

2013Patents assigned to BURKE CATHIE J (3)· patent assignee history

2013Patents assigned to LEBENS JOHN A (3)· patent assignee history

2013Patents assigned to CHWALEK JAMES M (2)· patent assignee history

2021Based in Austin, TX, US· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
XEROX CORP	38	1990–2007
EASTMAN KODAK CO	4	2010–2013
BURKE CATHIE Jself	3	2013
LEBENS JOHN A	3	2013
CHWALEK JAMES M	2	2013

Locations

Location	Patents	Span
Rochester, New York, US	43	1991–2013
Austin, Texas, US	1	2021
Brighton, New York, US	1	1990