Inventor
YUNG-LUNG LIN
Inventor
TW
Overview
Patents· 15 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices32%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1027%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1016%
H10DInorganic electric semiconductor devices9%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation5%
B23KSoldering or unsoldering2%
B24BMachines, devices, or processes for grinding or polishing2%
B28DWorking stone or stone-like materials2%
G02BOptical elements, systems or apparatus2%
G05BControl or regulating systems in general2%
PatentTitleYear
12,519,020Semiconductor processing tool and methods of operation202612,360,314Photonic semiconductor-on-insulator (SOI) substrate and method for forming the photonic SOI substrate202512,315,843Hybrid bonding technology for stacking integrated circuits202512,300,670Hybrid bond pad structure202512,293,946Techniques for wafer stack processing202512,237,165Method for wafer bonding including edge trimming202511,984,4313DIC structure and methods of forming202411,951,569Damage prevention during wafer edge trimming202411,842,992Seal ring structures and methods of forming same202311,804,473Hybrid bond pad structure202311,587,9083DIC structure and methods of forming202311,545,395Techniques for wafer stack processing202311,410,972Hybrid bonding technology for stacking integrated circuits202211,342,322Seal ring structures and methods of forming same202211,322,481Hybrid bonding technology for stacking integrated circuits2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2026Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (15)· patent assignee history
2022–2026Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 15 | 2022–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 15 | 2022–2026 |