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Inventor

David Danovitch

Inventor
Granby, CA

Overview

13→
Patents
2004–2013
Patent span
Electricity
Primary field (CPC H)

Patents· 13 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1048%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1016%
G02BOptical elements, systems or apparatus8%
H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light8%
H05KPrinted circuits8%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation8%
G01RMeasuring electric variables4%
PatentTitleYear
8,559,474'Silicon carrier optoelectronic packaging'20138,421,217'Achieving mechanical and thermal stability in a multi-chip package'20138,290,008'Silicon carrier optoelectronic packaging'20128,202,765'Achieving mechanical and thermal stability in a multi-chip package'20127,952,205'Injection molded soldering process and arrangement for three-dimensional structures'20117,820,483'Injection molded soldering process and arrangement for three-dimensional structures'20107,786,588'Composite interconnect structure using injection molded solder technique'20107,538,432'Temporary structure to reduce stress and warpage in a flip chip organic package'20097,498,198'Structure and method for stress reduction in flip chip microelectronic packages using underfill materials with spatially varying properties'20097,473,618'Temporary structure to reduce stress and warpage in a flip chip organic package'20097,038,462'Method and apparatus for electrical commoning of circuits'20066,893,799'Dual-solder flip-chip solder bump'20056,819,566'Grounding and thermal dissipation for integrated circuit packages'2004

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2004–2013Patents assigned to IBM (13)· patent assignee history
2004–2010Based in Granby, CA· patent location history
2005–2013Based in Quebec, CA· patent location history
2012–2013Patents assigned to DANOVITCH DAVID (4)· patent assignee history
2012–2013Patents assigned to OUIMET SYLVAIN (4)· patent assignee history
2012–2013Patents assigned to ANDRY PAUL S (2)· patent assignee history
2012–2013Patents assigned to BUDD RUSSELL A (2)· patent assignee history
2012–2013Based in Bromont, CA· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
IBM132004–2013
DANOVITCH DAVIDself42012–2013
OUIMET SYLVAIN42012–2013
ANDRY PAUL S22012–2013
BUDD RUSSELL A22012–2013
Locations
LocationPatentsSpan
Granby, CA62004–2010
Quebec, CA52005–2013
Bromont, CA22012–2013