Inventor
HIROSHI MORIKAZU
Inventor
JP
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
B23Kprimary
B23KSoldering or unsoldering33%
H01LSemiconductor devices22%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1019%
H10HInorganic light-emitting semiconductor devices having potential barriers7%
B23QDetails, components, or accessories for machine tools, e.g. arrangements for copying or controlling4%
B32BLayered products, i.e. products built-up of strata of flat or non-flat, e.g. cellular or honeycomb, form4%
G01JMeasurement of intensity, velocity, spectral content, polarisation, phase or pulse characteristics of infrared, visible or ultraviolet light4%
G01MTesting static or dynamic balance of machines or structures4%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h104%
PatentTitleYear
12,533,751Laser processing apparatus and laser processing method202612,343,812Laser processing apparatus202512,337,412Laser processing apparatus and laser processing method202512,290,881Laser processing method202512,151,312Laser processing apparatus202411,933,667Inspection apparatus and inspection method202411,654,511Laser processing apparatus202311,597,040Laser processing apparatus202311,211,296Comparing method and laser processing apparatus2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2026Patents assigned to DISCO CORP (9)· patent assignee history
2021–2026Based in JP· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| DISCO CORP | 9 | 2021–2026 |
Locations
| Location | Patents | Span |
|---|---|---|
| JP | 9 | 2021–2026 |