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Inventor

Connie Tangpuz

Inventor
Lapu-Lapu, PH

Overview

3→
Patents
2003–2007
Patent span
Electricity
Primary field (CPC H)

Patents· 3 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1060%
H05KPrinted circuits20%
Y02PClimate change mitigation technologies in the production or processing of goods20%
PatentTitleYear
7,256,479'Method to manufacture a universal footprint for a package with exposed chip'20077,101,734'Flip chip substrate design'20066,661,082'Flip chip substrate design'2003

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2003–2007Patents assigned to FAIRCHILD SEMICONDUCTOR (3)· patent assignee history
2003–2007Based in Lapu-Lapu, PH· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
FAIRCHILD SEMICONDUCTOR32003–2007
Locations
LocationPatentsSpan
Lapu-Lapu, PH32003–2007