Inventor
WILLIAM M. HIATT
Inventor
US
Overview
Patents· 3 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices43%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1043%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1014%
PatentTitleYear
12,014,958Microfeature workpieces and methods for forming interconnects in microfeature workpieces202411,476,160Microfeature workpieces and methods for forming interconnects in microfeature workpieces202211,177,175Microelectronic devices and methods for filling vias in microelectronic devices2021Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2021–2024Patents assigned to MICRON TECHNOLOGY INC (3)· patent assignee history
2021–2024Based in US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| MICRON TECHNOLOGY INC | 3 | 2021–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| US | 3 | 2021–2024 |