Inventor
Ganesh Balasubramanian
Inventor
Sunnyvale, CA, US
Overview
Patents· 67 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1021%
C23CCoating metallic material19%
H01LSemiconductor devices14%
H01JElectric discharge tubes or discharge lamps13%
B08BCleaning in general3%
G01BMeasuring length, thickness or similar linear dimensions3%
G01NInvestigating or analysing materials by determining their chemical or physical properties3%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h103%
Y10STechnical subjects covered by former uspc cross-reference art collections [xracs] and digests3%
H01HElectric switches2%
PatentTitleYear
11,133,210Dual temperature heater202111,122,021Server for handling multi-encrypted messages202111,120,976Apparatus and methods for removing contaminant particles in a plasma process202111,069,514Remote capacitively coupled plasma source with improved ion blocker202111,031,262Loadlock integrated bevel etcher system202111,024,522Virtual sensor for spatially resolved wafer temperature control202110,804,044Electrical contact alloy for vacuum contactors202010,793,954PECVD process202010,796,867Coil-type axial magnetic field contact assembly for vacuum interrupter202010,790,121Plasma density control on substrate edge202010,755,903RPS defect reduction by cyclic clean induced RPS cooling202010,748,797Plasma parameters and skew characterization by high speed imaging202010,714,319Apparatus and methods for removing contaminant particles in a plasma process202010,688,538Aluminum fluoride mitigation by plasma treatment202010,636,630Processing chamber and method with thermal control202010,636,684Loadlock integrated bevel etcher system202010,600,624System and method for substrate processing chambers202010,580,623Plasma processing using multiple radio frequency power feeds for improved uniformity202010,544,508Controlling temperature in substrate processing systems202010,468,205Electrical contact alloy for vacuum contactors201910,403,535Method and apparatus of processing wafers with compressive or tensile stress at elevated temperatures in a plasma enhanced chemical vapor deposition system201910,403,515Loadlock integrated bevel etcher system201910,385,448Apparatus and method for purging gaseous compounds201910,373,822Gas flow profile modulated control of overlay in plasma CVD films201910,325,800High temperature electrostatic chucking with dielectric constant engineered in-situ charge trap materials201910,325,799Dual temperature heater201910,276,353Dual-channel showerhead for formation of film stacks201910,227,695Shadow ring for modifying wafer edge and bevel deposition201910,161,035Apparatus and method for purging gaseous compounds201810,128,118Bottom and side plasma tuning having closed loop control201810,100,408Edge hump reduction faceplate by plasma modulation201810,094,486Method and system for supplying a cleaning gas into a process chamber201810,060,032PECVD process201810,030,306PECVD apparatus and process20189,922,819'Wafer rotation in a semiconductor chamber'20189,837,265Gas flow profile modulated control of overlay in plasma CVD films20179,816,187'PECVD process'20179,698,571'Triggered arc flash arrester and shield element for use therewith'20179,593,419'Wafer rotation in a semiconductor chamber'20179,546,541'Gas lift valves'20179,524,889'Processing systems and apparatus adapted to process substrates in electronic device manufacturing'20169,518,456'Coiled tubing deployed gas injection mandrel'20169,490,154'Method of aligning substrate-scale mask with substrate'20169,458,537'PECVD process'20169,390,910'Gas flow profile modulated control of overlay in plasma CVD films'20169,355,876'Process load lock apparatus, lift assemblies, electronic device processing systems, and methods of processing substrates in load lock locations'20169,337,072'Apparatus and method for substrate clamping in a plasma chamber'20169,206,511'Method and system for supplying a cleaning gas into a process chamber'20159,157,151'Elimination of first wafer effect for PECVD films'20159,157,730'PECVD process'20159,025,299'Triggered arc flash arrester and shield element for use therewith'20158,778,813'Confined process volume PECVD chamber'20148,591,699'Method and system for supplying a cleaning gas into a process chamber'20138,282,734'Methods to improve the in-film defectivity of PECVD amorphous carbon films'20128,197,636'Systems for plasma enhanced chemical vapor deposition and bevel edge etching'20127,922,440'Apparatus and method for centering a substrate in a process chamber'20117,867,578'Method for depositing an amorphous carbon film with improved density and step coverage'20117,829,145'Methods of uniformity control for low flow process and chamber to chamber matching'20107,802,538'Method to deposit functionally graded dielectric films via chemical vapor deposition using viscous precursors'20107,699,935'Method and system for supplying a cleaning gas into a process chamber'20107,622,005'Uniformity control for low flow process and chamber to chamber matching'20097,572,337'Blocker plate bypass to distribute gases in a chemical vapor deposition system'20097,514,125'Methods to improve the in-film defectivity of PECVD amorphous carbon films'20097,273,823'Situ oxide cap layer development'20077,259,111'Interface engineering to improve adhesion between low k stacks'20077,189,658'Strengthening the interface between dielectric layers and barrier layers with an oxide layer of varying composition profile'20077,166,544'Method to deposit functionally graded dielectric films via chemical vapor deposition using viscous precursors'2007Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2007–2021Patents assigned to APPLIED MATERIALS INC (59)· patent assignee history
2007–2020Based in Sunnyvale, CA, US· patent location history
2012–2019Patents assigned to BALASUBRAMANIAN GANESH (7)· patent assignee history
2012–2019Patents assigned to CHAN CHIU (4)· patent assignee history
2012–2016Patents assigned to JANAKIRAMAN KARTHIK (4)· patent assignee history
2012–2019Patents assigned to PADHI DEENESH (4)· patent assignee history
2015–2020Based in Horseheads, NY, US· patent location history
2016–2021Based in Fremont, CA, US· patent location history
2016–2017Based in Singapore, SG· patent location history
2021Based in Chennai, IN· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| APPLIED MATERIALS INC | 59 | 2007–2021 |
| BALASUBRAMANIAN GANESHself | 7 | 2012–2019 |
| CHAN CHIU | 4 | 2012–2019 |
| JANAKIRAMAN KARTHIK | 4 | 2012–2016 |
| PADHI DEENESH | 4 | 2012–2019 |
Locations
| Location | Patents | Span |
|---|---|---|
| Sunnyvale, California, US | 47 | 2007–2020 |
| Fremont, California, US | 12 | 2016–2021 |
| Horseheads, New York, US | 5 | 2015–2020 |
| Singapore, SG | 2 | 2016–2017 |
| Chennai, IN | 1 | 2021 |