Inventor

Shinji Rokuhara

Inventor

Kanagawa, JP

Overview

12→

Patents

2012–2020

Patent span

Electricity

Primary field (CPC H)

Patents· 12 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Wprimary

H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1021%

H01LSemiconductor devices15%

H05KPrinted circuits13%

G02BOptical elements, systems or apparatus8%

H01SDevices using the process of light amplification by stimulated emission of radiation [laser] to amplify or generate light8%

H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation8%

H04QSelecting6%

G02FOptical devices or arrangements for the control of light by modification of the optical properties of the media of the elements involved therein4%

H10DInorganic electric semiconductor devices4%

H10KOrganic electric solid-state devices4%

PatentTitleYear

10,634,862Optical communication device, reception apparatus, transmission apparatus, and transmission and reception system2020 10,593,606Wiring board, and manufacturing method2020 10,483,413Photoelectric module and optical device2019 10,410,884Wiring substrate, method of manufacturing wiring substrate, component-embedded glass substrate, and method of manufacturing component-embedded glass substrate2019 10,168,498Optical communication device, reception apparatus, transmission apparatus, and transmission and reception system2019 10,109,571Wiring substrate and manufacturing method of wiring substrate2018 9,723,724'Wiring substrate, method of manufacturing wiring substrate, component-embedded glass substrate, and method of manufacturing component-embedded glass substrate'2017 9,648,794'Wiring board and electronic apparatus'2017 9,614,347'Optical communication device, reception apparatus, transmission apparatus, and transmission and reception system'2017 8,497,567'Thin-film capacitor, multilayer wiring board and semiconductor device'2013 8,482,107'Circular shield of a circuit-substrate laminated module and electronic apparatus'2013 8,254,144'Circuit board laminated module and electronic equipment'2012

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

2012–2020Patents assigned to SONY CORP (12)· patent assignee history

2012–2013Patents assigned to ROKUHARA SHINJI (3)· patent assignee history

2012–2013Patents assigned to MATSUMOTO KATSUJI (2)· patent assignee history

2012–2013Patents assigned to OKA SHUICHI (2)· patent assignee history

2012–2013Patents assigned to YANAGAWA SHUSAKU (2)· patent assignee history

2012–2020Based in Kanagawa, JP· patent location history

2018Based in Minato-ku, JP· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees

Assignee	Patents	Span
SONY CORP	12	2012–2020
ROKUHARA SHINJIself	3	2012–2013
MATSUMOTO KATSUJI	2	2012–2013
OKA SHUICHI	2	2012–2013
YANAGAWA SHUSAKU	2	2012–2013

Locations

Location	Patents	Span
Kanagawa, JP	11	2012–2020
Minato-ku, JP	1	2018