Inventor
ING-JU LEE
Inventor
TW
Overview
Patents· 5 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices25%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1025%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1025%
H10FInorganic semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation15%
C25DProcesses for the electrolytic or electrophoretic production of coatings10%
PatentTitleYear
12,051,659Semiconductor devices having conductive pad structures with multi-barrier films202411,688,703Methods of fabricating semiconductor devices having conductive pad structures with multi-barrier films202311,598,016Electrochemical plating system and method of using202311,309,265Methods of fabricating semiconductor devices having conductive pad structures with multi-barrier films202211,230,784Electrochemical plating system and method of using2022Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2022–2024Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (5)· patent assignee history
2022–2024Based in TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 5 | 2022–2024 |
Locations
| Location | Patents | Span |
|---|---|---|
| TW | 5 | 2022–2024 |