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Inventor

Rodney C. Kistler

Inventor
Los Gatos, CA, US

Overview

45→
Patents
1990–2021
Patent span
Electricity
Primary field (CPC H)

Patents· 45 as inventor

Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.

H10Pprimary
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1026%
B24BMachines, devices, or processes for grinding or polishing17%
C09GPolishing compositions14%
C23FNon-mechanical removal of metallic material from surface11%
C09KMaterials for miscellaneous applications, not provided for elsewhere9%
G01BMeasuring length, thickness or similar linear dimensions6%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h104%
G02BOptical elements, systems or apparatus3%
G01NInvestigating or analysing materials by determining their chemical or physical properties2%
G05BControl or regulating systems in general2%
PatentTitleYear
11,057,980Extended signaling capacity in a DALI system20218,105,131'Method and apparatus for removing material from microfeature workpieces'20127,875,548'Method for making semiconductor structures implementing sacrificial material'20117,628,680'Method and apparatus for removing material from microfeature workpieces'20097,537,511'Embedded fiber acoustic sensor for CMP process endpoint'20097,425,501'Semiconductor structure implementing sacrificial material and methods for making and implementing the same'20087,381,648'Chemical mechanical polishing slurry useful for copper substrates'20087,309,618'Method and apparatus for real time metal film thickness measurement'20077,294,049'Method and apparatus for removing material from microfeature workpieces'20077,205,166'Method and apparatus of arrayed, clustered or coupled eddy current sensor configuration for measuring conductive film properties'20077,128,803'Integration of sensor based metrology into semiconductor processing tools'20067,084,621'Enhancement of eddy current based measurement capabilities'20067,010,468'Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detection'20066,984,892'Semiconductor structure implementing low-K dielectric materials and supporting stubs'20066,951,624'Method and apparatus of arrayed sensors for metrological control'20056,937,915'Apparatus and methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control'20056,929,531'System and method for metal residue detection and mapping within a multi-step sequence'20056,925,348'Methods for detecting transitions of wafer surface properties in chemical mechanical polishing for process status and control'20056,922,053'Complementary sensors metrological process and method and apparatus for implementing the same'20056,896,596'Polishing pad ironing system'20056,894,491'Method and apparatus for metrological process control implementing complementary sensors'20056,890,245'Byproduct control in linear chemical mechanical planarization system'20056,875,322'Electrochemical assisted CMP'20056,859,765'Method and apparatus for slope to threshold conversion for process state monitoring and endpoint detection'20056,808,590'Method and apparatus of arrayed sensors for metrological control'20046,769,961'Chemical mechanical planarization (CMP) apparatus'20046,752,693'Afferent-based polishing media for chemical mechanical planarization'20046,653,224'Methods for fabricating interconnect structures having Low K dielectric properties'20036,620,037'Chemical mechanical polishing slurry useful for copper substrates'20036,593,239'Chemical mechanical polishing method useful for copper substrates'20036,579,157'Polishing pad ironing system and method for implementing the same'20036,569,350'Chemical mechanical polishing slurry useful for copper substrates'20036,540,587'Infrared end-point detection system'20036,447,371'Chemical mechanical polishing slurry useful for copper/tantalum substrates'20026,432,828'Chemical mechanical polishing slurry useful for copper substrates'20026,362,106'Chemical mechanical polishing method useful for copper substrates'20026,309,560'Chemical mechanical polishing slurry useful for copper substrates'20016,217,416'Chemical mechanical polishing slurry useful for copper/tantalum substrates'20016,126,853'Chemical mechanical polishing slurry useful for copper substrates'20006,063,306'Chemical mechanical polishing slurry useful for copper/tantalum substrate'20005,954,997'Chemical mechanical polishing slurry useful for copper substrates'19995,858,813'Chemical mechanical polishing slurry for metal layers and films'19995,195,161'Optical waveguide comprising Bragg grating coupling means'19935,039,190'Apparatus comprising an optical gain device, and method of producing the device'19914,923,271'Optical multiplexer/demultiplexer using focusing Bragg reflectors'1990

Career & activity timeline

Assembled from patent assignee/location history and declaration credentials.

1990–1993Based in Easton, PA, US· patent location history
1991–1993Patents assigned to AT & T BELL LAB (2)· patent assignee history
1999–2000Patents assigned to CABOT CORP (3)· patent assignee history
1999–2008Based in St. Charles, IL, US· patent location history
2000–2008Patents assigned to CABOT MICROELECTRONICS CORP (10)· patent assignee history
2002–2011Based in Los Gatos, CA, US· patent location history
2003–2011Patents assigned to LAM RES CORP (24)· patent assignee history
2007–2012Patents assigned to MICRON TECHNOLOGY INC (4)· patent assignee history
2007–2012Based in Eagle, ID, US· patent location history
2021Based in Ennenda, CH· patent location history

Inventor activity

Assignee and location history derived from the patent record.

Assignees
AssigneePatentsSpan
LAM RES CORP242003–2011
CABOT MICROELECTRONICS CORP102000–2008
MICRON TECHNOLOGY INC42007–2012
CABOT CORP31999–2000
AT & T BELL LAB21991–1993
Locations
LocationPatentsSpan
Los Gatos, California, US252002–2011
St. Charles, Illinois, US121999–2008
Eagle, ID, US42007–2012
Easton, Pennsylvania, US31990–1993
Ennenda, CH12021