Inventor
Kuang-Chun Lee
Inventor
New Taipei, TW
Overview
Patents· 9 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices41%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1041%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1018%
PatentTitleYear
10,797,006Structure and formation method of chip package with lid202010,790,164Method for forming package structure202010,714,463Method of forming semicondcutor device package202010,504,880Method of forming semicondcutor device package201910,276,551Semiconductor device package and method of forming semiconductor device package201910,163,816Structure and formation method of chip package with lid20189,870,975'Chip package with thermal dissipation structure and method for forming the same'20189,748,156'Semiconductor package assembly, semiconductor package and forming method thereof'20179,653,391'Semiconductor packaging structure and manufacturing method thereof'2017Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2017–2020Patents assigned to TAIWAN SEMICONDUCTOR MFG CO LTD (9)· patent assignee history
2017–2020Based in New Taipei, TW· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| TAIWAN SEMICONDUCTOR MFG CO LTD | 9 | 2017–2020 |
Locations
| Location | Patents | Span |
|---|---|---|
| New Taipei, TW | 9 | 2017–2020 |