Inventor
Daniel J. Dechene
Inventor
Watervliet, NY, US
Overview
Patents· 11 as inventor
Public. Assignee & technology derived from the patent record. Each patent links to its LexDana page.
H01Lprimary
H01LSemiconductor devices25%
H10DInorganic electric semiconductor devices23%
H10PGeneric processes or apparatus for the manufacture or treatment of devices covered by class h1020%
H10WGeneric packages, interconnections, connectors or other constructional details of devices covered by class h1020%
G06FElectric digital data processing5%
H10BElectronic memory devices5%
G03FPhotomechanical production of textured or patterned surfaces, e.g. for printing, for processing of semiconductor devices3%
PatentTitleYear
11,024,551Metal replacement vertical interconnections for buried capacitance202110,998,193Spacer-assisted lithographic double patterning202110,867,912Dummy fill scheme for use with passive devices202010,833,160Field-effect transistors with self-aligned and non-self-aligned contact openings202010,691,862Layouts for connecting contacts with metal tabs or vias202010,332,745Dummy assist features for pattern support201910,217,633Substantially defect-free polysilicon gate arrays201910,170,309Dummy pattern addition to improve CD uniformity20199,780,002'Threshold voltage and well implantation method for semiconductor devices'20179,252,022'Patterning assist feature to mitigate reactive ion etch microloading effect'20168,656,322'Fin design level mask decomposition for directed self assembly'2014Career & activity timeline
Assembled from patent assignee/location history and declaration credentials.
2014–2021Patents assigned to IBM (4)· patent assignee history
2014–2019Based in Wappingers Falls, NY, US· patent location history
2016–2020Patents assigned to GLOBALFOUNDRIES INC (8)· patent assignee history
2017–2021Based in Watervliet, NY, US· patent location history
Inventor activity
Assignee and location history derived from the patent record.
Assignees
| Assignee | Patents | Span |
|---|---|---|
| GLOBALFOUNDRIES INC | 8 | 2016–2020 |
| IBM | 4 | 2014–2021 |
Locations
| Location | Patents | Span |
|---|---|---|
| Watervliet, New York, US | 8 | 2017–2021 |
| Wappingers Falls, New York, US | 3 | 2014–2019 |